Focus ring adjustment assembly of a system for processing workpieces under vacuum

ABSTRACT

A focus ring adjustment assembly of a system for processing workpieces under vacuum, where the focus ring may include a lower side having a first surface portion and a second surface portion, the first surface portion being vertically above the second surface portion. The adjustment assembly may include a pin configured to selectively contact the first surface portion of the focus ring, and an actuator operable to move the pin along the vertical direction between an extended position and a retracted position. The extended position of the pin may be associated with the distal end of the pin contacting the first surface of the focus ring and the focus ring being accessible for removal by a workpiece handling robot from the vacuum process chamber.

PRIORITY CLAIM

The present application claims the benefit of priority of U.S.Provisional Application Ser. No. 62/847,595, titled “SYSTEMS AND METHODSFOR TRANSPORTATION OF REPLACEABLE PARTS IN A VACUUM PROCESSINGAPPARATUS,” filed on May 14, 2019, which is incorporated herein byreference.

FIELD

The present disclosure relates generally to processing workpieces andmore particularly to a focus ring adjustment assembly of a system forprocessing workpieces, such as semiconductor workpieces, under vacuum.

BACKGROUND

Processing systems which expose workpieces such as, semiconductor wafersor other suitable substrates, to an overall treatment regimen forforming semiconductor devices or other devices can perform a pluralityof treatment steps, such as plasma processing (e.g., strip, etch, etc.),thermal treatment (e.g. annealing), deposition (e.g., chemical vapordeposition), etc. To carry out these treatment steps, a system mayinclude one or more robots to move workpieces a. number of differenttimes, for example, into the system, between various processingchambers, and out of the system. In semiconductor workpiece processing,it can be necessary from time to time to perform routine maintenanceand/or preventative maintenance on processing systems. This can require,in certain instances, physical replacement of certain parts in theprocessing systems.

SUMMARY

Aspects and advantages of embodiments of the present disclosure will beset forth in prat in the following description, or may be learned fromthe description, or may be learned through practice of the invention.

One example embodiment of the present disclosure is directed to a focusring adjustment assembly of a system for processing workpieces undervacuum, where the focus ring extends along a vertical direction betweenan upper side and a lower side, the lower side having a first surfaceportion and a second surface portion and the first surface portion beingvertically above the second surface portion. The focus ring adjustmentassembly includes a pin extending between a proximal end and a distalend, with the distal end being configured to selectively contact thefirst surface portion of the focus ring. The focus ring adjustmentassembly further includes an actuator operable to move the pin along thevertical direction between an extended position and a retractedposition. The extended position of the pin is associated with the distalend of the pin contacting the first surface of the focus ring, and thefocus ring being accessible for removal by a workpiece handling robotfrom the vacuum process chamber.

Other example aspects are directed to systems and methods for processinga workpiece. Variations and modifications can be made to example aspectsof the present disclosure.

These and other features, aspects and advantages of various embodimentswill become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateembodiments of the present disclosure and, together with thedescription, serve to explain the related principles.

BRIEF DESCRIPTION OF THE DRAWINGS

Detailed discussion of embodiments directed to one of ordinary skill inthe art are set forth in the specification, which makes reference to theappended figures, in which:

FIG. 1 depicts a plan view of an example processing system according toexample embodiments of the present disclosure;

FIG. 2 depicts a plan view of an example processing system according toexample embodiments of the present disclosure;

FIG. 3 depicts a plan view of an example processing system according toexample embodiments of the present disclosure;

FIG. 4 depicts an example transfer position according to exampleembodiments of the present disclosure;

FIG. 5 depicts an example workpiece column according to exampleembodiments of the present disclosure;

FIG. 6 depicts an example robotic arm motion pattern according toexample embodiments of the present disclosure;

FIG. 7 depicts an example flow diagram of an example method according toexample embodiments of the present disclosure;

FIG. 8 depicts an example flow diagram of an example method according toexample embodiments of the present disclosure;

FIG. 9 depicts a perspective view of an example end effector accordingto example embodiments of the present disclosure;

FIG. 10A depicts a perspective view of a first configuration of supportelements on the end effector of FIG. 9 for supporting an exampleworkpiece and focus ring according to example embodiments of the presentdisclosure;

FIG. 10B depicts a side view of the support elements on the end effectorshown in FIG. 10A according to example embodiments of the presentdisclosure;

FIG. 11A depicts a perspective view of a second configuration of supportelements on the end effector of FIG. 9 for supporting an exampleworkpiece and focus ring according to example embodiments of the presentdisclosure;

FIG. 11B depicts a side view of the support elements on the end effectorshown in FIG. 11A according to example embodiments of the presentdisclosure;

FIG. 12A depicts a partial perspective view of a third configuration ofsupport elements on the end effector of FIG. 9 for supporting an exampleworkpiece and focus ring according to example embodiments of the presentdisclosure;

FIG. 12B depicts a side view of the support elements on the end effectorshown in FIG. 12A according to example embodiments of the presentdisclosure;

FIG. 13 depicts a perspective view of a focus ring adjustment assemblyof an example processing system according to example embodiments of thepresent disclosure;

FIG. 14A. depicts a side, sectional view of the adjustment assemblyshown in FIG. 13 with a focus ring in a lowered position according toexample embodiments of the present disclosure;

FIG. 14B depicts a side, sectional view of the adjustment assembly shownin FIG. 13 with a focus ring in a raised position according to exampleembodiments of the present disclosure;

FIG. 15A depicts a section view of a first embodiment of a focus ringfor use with the adjustment assembly shown in FIG. 13 according toexample embodiments of the present disclosure;

FIG. 15B depicts a section view of a second embodiment of a focus ringfor use with the adjustment assembly shown in FIG. 13 according toexample embodiments of the present disclosure;

FIG. 16 depicts a top-down view of a pin support plate of the adjustmentassembly shown in FIGS. 14A-14B according to example embodiments of thepresent disclosure;

FIG. 17 depicts a schematic view of an actuating system for theadjustment assembly shown in FIGS. 14A-14B according to exampleembodiments of the present disclosure;

FIG. 18 depicts a plasma processing apparatus according to exampleembodiments of the present disclosure;

FIG. 19 depicts a focus ring adjustment assembly holding a focus ring ofa plasma processing apparatus in a first position according to exampleembodiments of the present disclosure; and

FIG. 20 depicts a focus ring adjustment assembly holding a focus ring ofa plasma processing apparatus in a second position according to exampleembodiments of the present disclosure.

DETAILED DESCRIPTION

Reference now will be made in detail to embodiments, one or moreexamples of which are illustrated in the drawings. Each example isprovided by way of explanation of the embodiments, not limitation of thepresent disclosure. In fact, it will be apparent to those skilled in theart that various modifications and variations can be made to theembodiments without departing from the scope or spirit of the presentdisclosure. For instance, features illustrated or described as part ofone embodiment can be used with another embodiment to yield a stillfurther embodiment. Thus, it is intended that aspects of the presentdisclosure cover such modifications and variations.

Example aspects of the present disclosure are directed to systems andmethods for automated replacement of replaceable parts in semiconductorworkpiece processing equipment. The systems and methods can provide formanipulating the replaceable parts through a vacuum apparatus. Examplereplaceable parts can include focus rings used in plasma processingchambers (e.g., plasma dry etch chambers) for semiconductor workpieces.

In workpiece processing systems, preventative maintenance can beperformed by trained technicians that perform physical acts of labor toreplace replaceable parts, such as focus rings in plasma dry etchchambers. In vacuum processing systems, this can require venting of theprocessing chambers to atmosphere and opening of the processing chambersfor access. This can lead to expensive downtime in semiconductor devicemanufacturing processes. In addition, when a processing chamber is opento the environment, the potential contamination of other processingparts has increased risk and other chamber parts can need to be removedand/or replaced.

For instance, a process for performing maintenance on semiconductorprocessing equipment has included monitoring for a trigger condition,such as workpiece count, plasma exposure time (e.g., for a plasmaprocessing tool), etc. Upon occurrence of a trigger condition, a vacuumprocessing chamber can be taken offline, reducing workpiece throughput.A service technician can implement processing chamber conditioning(e.g., plasma cleaning) to put the vacuum processing chamber in a safeopening state. After conditioning, the technician can vent the vacuumprocessing chamber. The technician can open the vacuum processingchamber to access the interior and start removal of certain chamberparts (e.g., focus rings). After cleaning of any unremoved parts,replacement parts can be added to the processing chamber and the vacuumprocessing chamber can be closed and evacuated. Once back online, somequalification workpieces can be run through the vacuum processingchamber. Once the vacuum processing chamber is producing a successfulresult, the processing chamber can be put back into semiconductor deviceproduction.

According to example aspects of the present disclosure, workpieceprocessing equipment can be configured to automatically replace certainprocess chamber parts through robotics that are typically found inworkpiece processing equipment. More particularly, unused replaceableparts can be loaded into a storage area and made accessible to thevacuum transport robotics. The robotics can interface with a workpieceprocessing module to remove a consumed (used) chamber part and thenreplace it with a new (non-consumed) chamber part. The used part canthen be returned to the storage area where it can be removed without theneed to disrupt the workpiece processing chamber.

In some embodiments, after placement of the new (non-consumed) chamberpart, robotics can access a test workpiece (e.g., dummy wafer stored inthe storage area (e.g., on a shelf in the storage area). The roboticscan transfer the workpiece to the processing module and perform at testprocess. The systems can perform measurements to make sure the newchamber part has been placed correctly. In addition and/or in thealternative, various sensors (e.g., optical sensors) can performmeasurements relating to position of the new chamber part to make sureit has been positioned correctly. In some embodiments, an automatedwafer centering system can be used to adjust the motion of robotics inplacing the new (non-consumed) part in the processing module to ensureproper placement.

In some embodiments, the systems and methods according to exampleaspects of the present disclosure can be used to replace focus ringsused in plasma processing chambers. A focus ring can be positionedaround a periphery of a workpiece supported on a workpiece support(e.g., having cathode or bias electrode) in a plasma processingapparatus. The focus ring can be used, for instance, to shape the plasmain the vicinity of the workpiece. During plasma processing in a plasmaprocessing chamber, the focus ring can be exposed to plasma and as suchis exposed to deposition and erosion. As a result, focus rings may needto be periodically replaced in plasma processing chambers as part ofpreventative maintenance for a workpiece processing system.

Aspects of the present disclosure are discussed with reference to afocus ring as a replaceable part. Those of ordinary skill in the art,using the disclosures provided herein, will understand that aspects ofthe present disclosure are applicable for replacing other replaceableparts in a vacuum processing chamber without deviating from the scope ofthe present disclosure.

In some embodiments, the systems can monitor for a trigger condition,such as a workpiece count, plasma exposure time, etc. Upon occurrence ofthe trigger condition, an in-situ plasma dry clean process can beimplemented to prepare the vacuum processing chamber. Once the in-situplasma dry clean process is complete, a lift mechanism outside of thevacuum processing chamber but coupled inside the chamber can use a setof pins to lift a focus ring that sits around a workpiece support in thevacuum processing chamber. After lifting the focus ring, a workpiecehandling robot can enter the chamber and lift the ring off the pins in avertical motion. The robot can retract and rotate to place the usedfocus ring on a shelf in a storage location. In some embodiments, theworkpiece handling robot can hand off the focus ring to a second robotfor placement into a storage location.

The robot can then move to a different shelf of the storage location andretrieve a new focus ring. After rotation to the vacuum processingmodule, the robot can extend to the needed position and the drop down toplace the focus ring on the lift pins. After the robot retracts from thevacuum processing module, the system can lower the lifting pins and dropthe ring into final position around the workpiece support (e.g.,including cathode). A conditioning plasma can be used to stabilizeprocess performance in the workpiece processing chamber and the vacuumprocessing chamber can be brought back online for normal operation. Atest workpiece (e.g., obtained from the storage location) can be used totest the processing module with a test process prior to bringing theprocess module back online for normal operation.

Example aspects of the present disclosure also include workpiecehandling robots capable of accessing one or more of the side-by-sideprocessing stations according to a particular robotic arm motionpattern. Specifically, the robotic arm motion pattern allows for the endeffector of the workpiece handling robot to enter a process chamberhaving side-by-side processing stations and then access one of theprocessing stations so as to transfer workpieces or replaceable partsfrom the processing station. The robotic arm motion pattern can includemoving the end effector according to a first direction for a firstperiod of time, moving the end effector according to a second directionthat is generally lateral to the first direction for a second period oftime, and moving the end effector according to a third direction that isdifferent from the first or second direction for a third period of time.The end effector can be moved according to the robotic arm motionpattern to access the processing station and can also be retracted fromthe processing station according to the same motion. In someembodiments, the robotic motion can be automatically controlled and/oradjusted in real time using sensors as part of, for instance, anautomated wafer centering system (e.g., optical sensors) to ensureproper placement of the replaceable parts in the processing station.

According to example aspects of the present disclosure, robotics used totransfer workpieces as part of a workpiece processing system can beadapted to transfer replaceable parts (e.g., focus rings) according toexample embodiments of the present disclosure. For instance, the roboticend effector can have a spatula design to accommodate workpiece supportpads and replaceable part support pads for supporting semiconductorworkpieces and replaceable parts. The end effectors can include at leastone common support pad that is configured to support both workpieces andreplaceable parts. Further, the end effectors can include at least onesupport pad for supporting workpieces that is positioned further from anaxis of the effector and from a distal end of the effector than at leastone other support pad for supporting replaceable parts.

Example aspects of the present disclosure also include a focus ringadjustment assembly for adjusting a position of a focus ring within aprocess chamber for removal and/or installation. Specifically, theadjustment assembly can include pins that are configured to raise afocus ring to one or more different vertical positions, for instance ,toallow the focus ring to be more readily removed from the focus chamberby an end effector and to lower a new focus ring to install the focusring around a workpiece support. The pins can be configured to contactthe vertically highest portion of a lower side of the focus ring.Additionally, in some embodiments, the pins can be rotatable to lock anazimuthal position of the focus ring to assist with proper centering ofthe focus ring relative to the workpiece support.

The focus ring adjustment assembly can include a lift pin movable alonga vertical direction to facilitate movement of a focus ring of theplasma processing apparatus to adjust a distance between the focus ringand a pedestal configured to support a substrate to be processed. Inparticular, the lift pin can be positioned outside of a RF zone definedby a bias electrode positioned within the pedestal, The lift pin canalso penetrate a ground plane positioned within the pedestal.

Aspects of the present disclosure can provide a number of technicaleffects and benefits. For instance, the robotic arm motion patternprovided herein can facilitate access to replaceable parts in processchambers having multiple processing stations, such as two processingstations. Furthermore, the storage chamber provided herein allows forstorage of used replaceable parts and retrieval of new replaceable partsfor the process chambers without having to break the overall vacuum ofthe system. In some embodiments, test workpieces can be included in thestorage chamber to be used in testing of replaceable parts afterplacement. The contact between the pins and the focus ring can preventlateral movement of the focus ring as the focus ring is raised andlowered to ensure the focus ring is precisely concentric to theelectrostatic chuck or other workpiece support. The end effector supportelements provided herein can reduce total number of parts, which reducescosts, and simplifies control patterns for moving the end effector.Further, the spatial configuration of the support pads on the endeffector can utilize existing openings of process chambers for movingreplaceable parts into and out of process chambers. Locating the liftpin outside of the RF zone and having the lift pin penetrate the groundplane can reduce arcing risks associated with applying RF power (e.g.bias power) from a RF source to the bias electrode during a plasmaprocess. Furthermore, there can be reduced interference (e.g.,electrical and mechanical) between the lift pin and the focus ring.

One example embodiment of the present disclosure is directed to a systemfor processing workpieces. The system includes a front end portionconfigured to be maintained at atmospheric pressure. The system includesa loadlock chamber disposed between the front end portion and a vacuumportion. The system includes one or more process chambers disposed inthe vacuum portion. Each process chamber can include two or moreprocessing stations. At least one transfer chamber can be disposed inthe vacuum portion. The system can includes a storage chamber configuredto store one or more replaceable parts coupled to the at least onetransfer chamber. The system can include one or more workpiece handlingrobots disposed in the at least one transfer chamber. The workpiecehandling robot can be configured to move the one or more replaceableparts between the storage chamber and the one or more process chambers.The workpiece handling robot can include an end effector configured tosupport a replaceable part. The system can include a controllerconfigured to control motion of the end effector according to a roboticarm motion pattern to access the processing station. The robotic armmotion pattern includes extending in a first direction for a firstperiod of time, extending in a second direction lateral to the firstdirection for a second period of time, and extending in a thirddirection different from the first direction and second direction for athird period of time. In some embodiments, the robotic arm motionpattern includes retracting the end effector back according to the samepattern.

As used herein, a controller can include one or more control devices,such as one or more processors. The one or more processors can beconfigured to execute computer-readable instructions stored in one ormore memory devices to send control signals to control operation ofvarious components according to any of the functions, operations, ormethods described herein.

In some embodiments, the one or more process chambers include a firstprocess chamber and a second process chamber disposed on opposite sidesof the transfer chamber. N In some embodiments, the one or more processchambers include a first process chamber and a second process chamberdisposed on opposing sides of the transfer chamber. The one or moreprocess chambers further include a third process chamber disposed in alinear arrangement with the first process chamber and a fourth processchamber disposed in a linear arrangement with the second process chambersuch that the third process chamber and the fourth process chamber aredisposed on opposing sides of the transfer chamber. Each of the firstprocess chamber, second process chamber, third process chamber, andfourth process chamber can include at least two process stations. Thetransfer chamber can include a transfer position configured to supportworkpieces and replaceable parts in a stacked arrangement. In someembodiments, the stacked arrangement includes a plurality of shelvesconfigured to house both workpieces and replaceable parts. Thereplaceable parts can have a larger diameter than the workpieces.

In some embodiments, the one or more workpiece handling robots caninclude a first workpiece handling robot and a second handling robot.The first workpiece handling robot can be configured to transferworkpieces and replaceable parts from the workpiece column, the firstprocess chamber, the second process chamber, and the transfer positionand the second workpiece handling robot configured to transferworkpieces and replaceable parts from the storage chamber, the thirdprocess chamber, the fourth process chamber, and the transfer positionfor automated processing of the workpieces and automated replacement ofreplaceable parts without breaking vacuum.

In some embodiments, the process chambers are configured to performplasma etch processes using a direct plasma. The two or more processingstations are in side-by-side arrangement. The two or more processingstations can be associated with a workpiece support for supporting aworkpiece during processing in the process chamber. The workpiecesupport includes a pedestal assembly comprising a baseplate, anelectrostatic chuck configured to support the workpiece, a replaceablepart including a focus ring arranged relative to the electrostatic chucksuch that at least a portion of the focus ring at least partiallysurrounds a periphery of the workpiece when the workpiece is positionedon the electrostatic chuck.

In some embodiments, the replaceable part includes a focus ring having alarger diameter than the workpiece.

In some embodiments, the storage chamber includes a plurality of shelvesconfigured to house both used and new replaceable parts.

In some embodiments, the plurality of shelves are coupled to an elevatorsuch that the elevator is configured to move replaceable parts up anddown within the storage chamber.

In some embodiments, the storage chamber is a vacuum capable storagechamber that includes one or more access doors configured to allow theworkpiece robot to access replaceable parts in the storage chamber andone or more access doors configured to allow for replacement of new orused replaceable parts from the atmospheric surrounding environment.

In some embodiments, the workpiece handling robot is configured totransfer one or more replaceable parts from the storage chamber to theat least two processing stations in the process chamber using a scissormotion.

Another example embodiment of the present disclosure is directed to asystem for processing workpieces. The system includes: a front endportion configured to be maintained at atmospheric pressure; a loadlockchamber disposed between the front end portion and a vacuum portion,wherein the loadlock chamber includes a workpiece column for storingworkpieces; a transfer chamber disposed in the vacuum portion having afirst workpiece handling robot, a second workpiece handling robot, and atransfer position configured to support workpieces and focus rings in astacked arrangement therein; a first process chamber, second processchamber, third process chamber, and fourth process chamber, wherein thefirst process chamber and second process chamber are disposed onopposite sides of the transfer chamber in the vacuum portion and thethird process chamber and further process chamber are disposed onopposite sides of the transfer chamber, wherein the third processchamber is in linear arrangement with the first process chamber and thefourth process chamber is in linear arrangement with the second processchamber, wherein each of the first process chamber, second processchamber, third process chamber, and fourth process chamber comprise twoor more processing stations in side-by-side arrangement. The system caninclude storage chamber configured to store one or more focus ringscoupled to the transfer chamber. The first workpiece handling robot andsecond workpiece handling robot each include an end effector configuredto support a focus ring. The system includes a controller configured tocontrol motion of the end effector according to a robotic arm motionpattern to access the processing station. The robotic arm motion patternincludes extending in a first direction for a first period of time,extending in a second direction lateral to the first direction for asecond period of time, and extending in a third direction different fromthe first direction and second direction for a third period of time, andretracting back according to the same robotic arm motion pattern. Thefirst workpiece handling robot can be configured to transfer theworkpieces and one or more focus rings between the workpiece column,first process chamber, second process chamber, and transfer position andthe second workpiece handling robot can be configured to transfer theworkpieces and one or more focus rings between the storage chamber,third process chamber, fourth process chamber, and transfer position forautomated processing of the workpieces and automated replacement offocus rings without breaking vacuum.

Another example embodiment of the present disclosure is directed to amethod for replacing replaceable parts in a system for processingworkpieces, the system including a transfer chamber having one or moreprocess chambers configured thereto, wherein each of the one or moreprocess chambers includes two or more processing stations inside-by-side arrangement, a storage chamber disposed on the transferchamber, one or more workpiece handling robots disposed in the transferchamber having an arm with an end effector configured thereto. Themethod can include: removing a used replaceable part from a processingstation in a process chamber with the workpiece handling robot,including accessing the processing station according to a robotic armmotion pattern including extending the end effector in a first directionfor a first period of time, extending in a second direction lateral tothe first direction for a second period of time, and extending in athird direction different from the first direction and second directionfor a third period of time, picking up the used replaceable part andretracting back according to the same pattern; transferring thereplaceable part to a storage chamber; removing a new replaceable partfrom the storage chamber with the workpiece handling robot; andtransferring the new replaceable part to the processing station.

In some embodiments, transferring the new replaceable part to theprocessing station includes utilizing the robotic arm motion pattern toplace the replaceable part in the processing station.

In some embodiments, transferring the replaceable part to a storagechamber includes utilizing a first workpiece handling robot to transferthe used replaceable part to a stacked arrangement in a transferposition in the transfer chamber and utilizing a second workpiecehandling robot to transfer the used replaceable part from the stackedarrangement in the transfer position to the storage chamber.

In some embodiments, removing a new replaceable part from the storagechamber with the workpiece handling robot includes utilizing the secondworkpiece handling robot to transfer the new replaceable part from thestorage chamber to the stacked arrangement in the transfer chamber andutilizing the first workpiece handling robot to transfer the replaceablepart from the stacked arrangement in the transfer position to theprocessing station.

In some embodiments, the stacked arrangement includes a plurality ofshelves configured to support one or more replaceable parts having alarger diameter than the workpieces.

Another example embodiment is directed to an end effector for movingworkpieces and replaceable parts within a system for processingworkpieces, where the end effector extends between a proximal end and adistal end along an axial direction. The end effector has an arm portionextending between a first arm end and a second arm end along the axialdirection, with the first arm end being at the proximal end of the endeffector. The end effector further has a spatula portion extendingbetween a first spatula end and a second spatula end along the axialdirection, with the first spatula end being adjacent the second arm endand the second spatula end being at the distal end of the end effector.Additionally, the end effector has a first support member extendingoutwardly from an upper surface of the spatula portion, a second supportmember extending outwardly from the upper surface of the spatulaportion, and a shared support member extending outwardly from an uppersurface of the arm portion. The shared support member and the firstsupport member together are configured to support workpieces of a firstdiameter, and the shared support member and the second support membertogether are configured to support replaceable parts of a seconddiameter.

In some embodiments, the first diameter can be smaller than the seconddiameter. Further, in one or more embodiments, the second support membercan be closer to the proximal end than the first support member.

Moreover, in sonic embodiments, the first and second support members arespaced apart along the longitudinal direction such that a first contactarea on the shared support member for workpieces supported on the firstsupport member can he separate from a second contact area on the sharedsupport member for replaceable parts supported on the second supportmember. In some embodiments, the second contact area can he closer tothe proximal end than the first contact area.

In some embodiments, the first and second support members can be spacedapart along the longitudinal direction such that a first contact area onthe shared support member for workpieces supported on the first supportmember and a second contact area on the shared support member forreplaceable parts supported on the second support member at leastpartially overlap.

Another example embodiment of the present disclosure is directed to anend effector for moving workpieces and replaceable parts within a systemfor processing workpieces, where the end effector extends between aproximal end and a distal end along an axial direction. The end effectorincludes an arm portion extending between a first arm end and a secondarm end along the axial direction, with the first arm end being at theproximal end of the end effector. The end effector further includes aspatula portion extending between a first spatula end and a secondspatula end along the axial direction, with the first spatula end beingadjacent the second arm end and the second spatula end being at thedistal end of the end effector. Moreover, the end effector includes afirst support member extending outwardly from an upper surface of thespatula portion, where the first support member is positioned at a firstdistance from a longitudinal axis of the end effector along a firstdirection. Additionally, the end effector includes a second supportmember extending outwardly from the upper surface of the spatulaportion, where the second support member is positioned at a seconddistance from the longitudinal axis of the end effector along the firstdirection. The first distance is greater than the second distance. Insome embodiments, the second support member can be closer to theproximal end than the first support member.

Some embodiments can include a further first support member and afurther second support member extending outwardly from the upper surfaceof the arm portion, where the first support member and the further firstsupport member are configured to support workpieces of a first diameter,and the second support member and the further second support member areconfigured support replaceable parts of a second diameter.

In some embodiments, the further second support member can be closer tothe distal end than the first support member.

In some embodiments, a shared support member extends outwardly from anupper surface of the arm portion, where the shared support member andthe first support member can be together configured to supportworkpieces of a first diameter, and the shared support member and thesecond support member can be together configured to support replaceableparts of a second diameter.

Further, in some embodiments, the first and second support members canbe spaced apart along the longitudinal direction such that a firstcontact area on the shared support member for workpieces supported onthe first support member is separate from a second contact area on theshared support member for replaceable parts supported on the secondsupport member.

Moreover, in some embodiments, the second contact area can be closer tothe proximal end than the first contact area.

Additionally, in some embodiments, the first and second support memberscan be spaced apart along the longitudinal direction such that a firstcontact area on the shared support member for workpieces supported onthe first support member and a second contact area on the shared supportmember for replaceable parts supported on the second support member atleast partially overlap.

Another example embodiment of the present disclosure is directed to afocus ring adjustment assembly of a system for processing workpiecesunder vacuum, where the focus ring extends along a vertical directionbetween an upper side and a lower side, the lower side having a firstsurface portion and a second surface portion and the first surfaceportion being vertically above the second surface portion. The focusring adjustment assembly includes a pin extending between a proximal endand a distal end, with the distal end being configured to selectivelycontact the first surface portion of the focus ring. The focus ringadjustment assembly further includes an actuator operable to move thepin along the vertical direction between an extended position and aretracted position. The extended position of the pin is associated withthe distal end of the pin contacting the first surface of the focusring, and the focus ring being accessible for removal by a workpiecehandling robot from the vacuum process chamber.

In some embodiments, the focus ring can be positioned vertically higheralong the vertical direction when the pin is in the extended positionrelative to when the pin is in a retracted position.

Some embodiments can include a rotary actuator configured to selectivelyrotate the pin, wherein rotation of the pin through a. predefinedlocking angle secures the focus ring to the pin.

In some embodiments, the pin has a main body portion and a flangeportion, where the main body portion extends between the proximal endand the distal end, and the flange portion is spaced apart from thedistal end of the pin and extends outwardly from the main body portion.The flange portion can be configured to contact a transition surfaceportion positioned vertically between the first surface portion and thesecond surface portion of the focus ring when the distal end of the pinis contacts the first surface portion of the focus ring.

Some embodiments further include a support plate positioned within thevacuum process chamber and a floating coupling fixed to the proximal endof the pin. The floating coupling can be slidably supported by thesupport plate such that the floating coupling is movable relative thesupport plate in a horizontal direction. The actuator can be configuredto move the support plate along the vertical direction between a raisedposition and a lowered position to move the pin between the extendedposition and the retracted position, Where the raised position of thesupport plate can be associated with the extended position of the pinand the lowered position of the support plate can be associated with theretracted position of the pin.

In some embodiments, the actuator can be vacuum sealed, with theactuator being positioned exterior to the vacuum process chamber, andthe actuator being coupled to the support plate via a connection shaftextending through an exterior wall of the vacuum process chamber.

Another example embodiment of the present disclosure is directed to afocus ring adjustment assembly of a system for processing workpiecesunder vacuum, with a focus ring extending between an upper side and alower side along a vertical direction, and the focus ring having agroove recessed inwardly from the lower side towards the upper side. Thefocus ring adjustment assembly can include a pin extending between aproximal end and a distal end, where the distal end can be configured toselectively contact the groove. Additionally, the focus ring adjustmentassembly can include an actuator operable to move the pin along thevertical direction between an extended position and a retractedposition. The extended position of the pin can be associated with thedistal end of the pin contacting the groove, and the focus ring beingaccessible for removal from the vacuum process chamber by a workpiecehandling robot.

In some embodiments, the focus ring can extend between an inner surfaceand an outer surface along a radial direction, with the groove beingannular about the focus ring and spaced apart from the inner and outersurfaces.

In at least one embodiment, the groove has a first groove portion and asecond groove portion, with the first groove portion extending from thelower side of the focus ring to a first distance from the lower side,and the second groove portion extending from the first distance to asecond distance from the lower side, where the second distance can beless than a thickness of the focus ring between the upper and lowersides along the vertical direction.

In embodiments, the pin can have a main body portion and a flangeportion, where the main body portion extends between the proximal anddistal ends, and the flange portion is spaced apart from the distal endof the pin and extending outwardly from the main body portion. Theflange portion can be configured to be at least partially receivedwithin the first groove portion, and the portion of the pin extendingbetween the flange portion and the distal end can be at least partiallyreceived within the second groove portion.

In some embodiments, the focus ring can be positioned vertically higheralong the vertical direction when the pin is in the extended positionrelative to when the pin is in the retracted position.

Further, some embodiments can include a support plate positioned withinthe vacuum process chamber and adjacent to an exterior wall of thevacuum process chamber, and a floating coupling fixed to the proximalend of the pin. The floating coupling can be slidably supported by thesupport plate such that the floating coupling is movable relative thesupport plate in a horizontal direction. The actuator can be configuredto move the support plate along the vertical direction between a raisedposition and a lowered position to move the pin between the extendedposition and the retracted position, with the raised position of thesupport plate being associated with the extended position of the pin andthe lowered position of the support plate being associated with theretracted position of the pin.

Additionally, in some embodiments, the actuator can be vacuum sealed,with the actuator being positioned exterior to the vacuum processchamber, and the actuator being coupled to the support plate via aconnection shaft extending through the exterior wall of the vacuumprocess chamber.

Another example embodiment of the present disclosure is directed to aplasma processing apparatus. The apparatus can include a processingchamber defining a vertical direction and a lateral direction. Theplasma processing apparatus can include a pedestal disposed within theprocessing chamber. The pedestal can be configured to support thesubstrate. The plasma processing apparatus can include a radio frequency(RF) bias electrode disposed within the pedestal. The RF bias electrodecan extend between a first end of the RF bias electrode and a second endof the RF bias electrode along the lateral direction. The RF biaselectrode can define a RF zone extending between the first end of the RFbias electrode and the second end of the RF bias electrode along thelateral direction. In some implementations, the RF zone can extend fromthe first end of the RF bias electrode to the second end of the RF biaselectrode along the lateral direction. Alternatively or additionally,the RF zone can extend between the RF bias electrode and a dielectricwindow of the plasma processing apparatus along the vertical direction.

The plasma processing apparatus can include a focus ring disposed withinthe processing chamber. The plasma processing apparatus can include afocus ring adjustment assembly that includes a lift pin positionedoutside of the RF zone. The lift pin can be movable along the verticaldirection to move the focus ring between at least a first position and asecond position to adjust a distance between the pedestal and the focusring along the vertical direction. In some implementations, the focusring is located on the pedestal when the focus ring is in the firstposition. Furthermore, the focus ring is spaced apart from the pedestalby a distance that is when the focus ring is in the second position.

In some implementations, the plasma processing apparatus can include aground plane spaced apart from the RF bias electrode along the verticaldirection. The ground plane can extend between a first end of the groundplane and a second end of the ground plane along the lateral direction.In some implementation, a length of the ground plane along the lateraldirection can be greater than a length of the RF bias electrode alongthe lateral direction. In some implementations, the lift pin penetratesthe ground plane. In some implementations, the RF bias electrode and theground plane are disposed within the pedestal.

In some implementations, the focus ring adjustment assembly can includean actuator configured to move the lift pin along the vertical directionto move the focus ring between at least the first position and thesecond position. In some implementations, the actuator is positionedoutside of the processing chamber. In some implementations, the focusring adjustment assembly can include a second actuator configured torotate the lift pin about the vertical direction. In someimplementations, the second actuator is positioned outside of theprocessing chamber.

Another example embodiment of the present disclosure is directed to aplasma processing apparatus. The apparatus can include a processingchamber defining a vertical direction and a lateral direction. Theplasma processing apparatus can include a pedestal disposed within theprocessing chamber. The pedestal can be configured to support thesubstrate. The plasma processing apparatus can include a radio frequency(RF) bias electrode disposed within the pedestal. The RF bias electrodecan extend between a first end of the RF bias electrode and a second endof the RF bias electrode along the lateral direction. The RF biaselectrode can define a RF zone extending between the first end of the RFbias electrode and the second end of the RF bias electrode along thelateral direction. The plasma processing apparatus can include a groundplane spaced apart from the RF bias electrode along the verticaldirection. The plasma processing apparatus can include a focus ringdisposed within the processing chamber. The plasma processing apparatuscan include a focus ring adjustment assembly that includes a lift pinthat penetrates the ground plane. The lift pin can be movable along thevertical direction to move the focus ring between at least a firstposition and a second position to adjust a distance between the pedestaland the focus ring along the vertical direction. In someimplementations, the lift pin can be positioned outside of the RF zone.

Referring now to the FIGS., example embodiments of the presentdisclosure will now be described.

FIG. 1 depicts an example workpiece processing system 100 according toexample embodiments of the present disclosure. The processing system 100can include a front end portion 112, one or more loadlock chambers 114,a transfer chamber 115 and a plurality of process chambers, including afirst process chamber 120 and a second process chamber 130. The systemcan include a first workpiece handling robot 150 for transferringworkpieces to and from the workpiece column 110 in the loadlock chamber114 and the first process chamber 120 and second process chamber 130and/or between the first process chamber 120 and the second processchamber 130.

The front end portion 112 can be configured to be maintained atatmospheric pressure and can he configured to engage workpiece inputdevices 118. The workpiece input devices 118 can include, for instance,cassettes, front opening unified pods, or other devices for supporting aplurality of workpieces. Workpiece input devices 118 can be used toprovide preprocess workpieces to the processing system 100 or to receivepost-process workpieces from the processing system 100.

The front end portion 112 can include one or more robots (notillustrated) for transferring workpieces from workpiece input devices118 to, for instance, the loadlock chamber 114, such as to and from aworkpiece column 110 located in the loadlock chamber 114. In oneexample, the robot in the front end portion 112 can transfer preprocessworkpieces to the loadlock chamber 114 and can transfer post-processworkpieces from the loadlock chamber 114 to one or more of the workpieceinput devices 118. Any suitable robot for transferring workpieces can beused in the front end portion 112 without deviating from the scope ofthe present disclosure. Workpieces can be transferred to and or from theloadlock chamber 114 through a suitable slit, opening, or aperture.

The loadlock chamber 114 can include a workpiece column 110 configuredto support a plurality of workpieces in a stacked arrangement. Theworkpiece column 110 can include, for instance, a plurality of shelves.Each shelf can be configured to support one or more workpieces. In oneexample implementation, the workpiece column 110 can include one or moreshelves for supporting preprocess workpieces and one or more shelves forsupporting post-process workpieces.

In some embodiments, appropriate valves can be provided in conjunctionwith the loadlock chamber 114 and other chambers to appropriately adjustthe process pressure for processing the workpieces. In some embodiments,the loadlock chamber 114 and the transfer chamber 115 can be maintainedat the same pressure. In this embodiment, there is no need to seal theloadlock chamber 114 from the transfer chamber 115. Indeed, in someembodiments, the loadlock chamber 114 and the transfer chamber 115 canbe a part of the same chamber.

A single loadlock chamber 114 is illustrated in FIG. 1. Those ofordinary skill in the art, using the disclosures provided herein, willunderstand that multiple loadlock chambers 114 can be used in any of theprocessing systems described herein without deviating from the scope ofthe present disclosure. For instance, the system 100 can include a firstloadlock chamber to transfer workpieces into a vacuum portion of thesystem 100 and a second loadlock chamber to transfer workpieces out of avacuum portion of the system 100.

The first process chamber 120 and the second process chamber 130 can beused to perform any of a variety of workpiece processing on theworkpieces, such as vacuum anneal processes, surface treatmentprocesses, dry strip processes, dry etch processes, depositionprocesses, and other processes. In sonic embodiments, one or more of thefirst process chamber 120 and the second process chamber 130 can includeplasma based process sources such as, for example, inductively coupledplasma (ICP) sources, microwave sources, surface wave plasma sources,ECR plasma sources, and capacitively coupled (parallel plate) plasmasources.

As illustrated, each of the first process chamber 120 and second processchamber 130 includes a pair of processing stations in side-by-sidearrangement so that a pair of workpieces can be simultaneously exposedto the same process. More particularly, the first process chamber 120can include a first processing station 122. and a second processingstation 124 in side-by-side arrangement. The second process chamber 130can include a first processing station 132 and a second processingstation 134 in side-by-side arrangement. Each processing station caninclude a workpiece support (e.g., a pedestal) for supporting aworkpiece during processing. In some embodiments, each processingstation can share a common pedestal with two portions for supporting aworkpiece. In some embodiments, the workpiece support can include apedestal assembly including a baseplate, an electrostatic chuckconfigured to support the workpiece and a replaceable part. Thereplaceable part can include a focus ring arranged relative to theelectrostatic chuck such that at least a portion of the focus ring atleast partially surrounds a periphery of the workpiece when theworkpiece is positioned on the electrostatic chuck. The first processchamber 120 and/or the second process chamber 130 can be selectivelysealed off from the transfer chamber 115 for processing.

The transfer chamber 115 can include a workpiece handling robot 150. Theworkpiece handling robot 150 can be configured to transfer workpiecesfrom the workpiece column 110 in the loadlock chamber 114 to theprocessing stations in the first process chamber 120 and/or the secondprocess chamber 130. The workpiece handling robot 150 can also transferworkpieces between the first process chamber 120 and the second processchamber 130.

As shown in FIG. 1, the workpiece processing system 100 can include astorage chamber 250 for storing new and/or used replaceable parts (e,g.,focus rings) coupled to the transfer chamber 115. In some embodiments,the storage chamber is mounted to a rear side of a transfer chamber 115.The storage chamber 250 can include a plurality of shelves configured tosupport replaceable parts. The shelves can be configured such that aplurality of replaceable parts can be supported in a vertical/stackedarrangement. In certain embodiments, the shelves can be coupled to anelevator such that the elevator is configured to move replaceable partsup and down within the storage chamber 250. In some embodiments, thestorage chamber 250 can include one or more test workpieces. Forinstance, one or more of the shelves can be configured to support a testworkpiece.

In some embodiments, the storage chamber 250 is a vacuum capable storagechamber capable of being maintained at the same vacuum as the transferchamber 115. In certain other embodiments, the storage chamber 250 isconfigured such that it can be sealed off from the transfer chamber 115.The vacuum capable storage chamber can include one or more access doorsconfigured to allow the workpiece handling robots to access replaceableparts in the storage chamber. For example, the access doors are largeenough such that the workpiece handling robots can place a usedreplaceable part on a shelf within the storage chamber 250 and canremove a new replaceable part from one of the shelves. Accordingly,replaceable parts can be placed in or removed from the storage chamber250 without breaking the vacuum of the overall system.

In some embodiments, the storage chamber 250 can include one or moreaccess doors configured to allow for replacement of new or usedreplaceable parts from the atmospheric surrounding environment. Forexample, in certain embodiments the storage chamber 250 in communicationwith the transfer chamber 115 can be sealed off such that the transferchamber 115 remains at a desired process pressure. The storage chamber250 can then be accessed and serviced from the atmospheric environmentsuch that used replaceable parts can be removed from the storage chamber250 and new replaceable parts can be placed within the storage chamber250. After service of the storage chamber 250 is complete, the storagechamber 250 can be brought back to the desired process pressureutilizing any known system for establishing a process pressure withinthe storage chamber 250. Once at the desired process pressure isachieved, such as the same process pressure or vacuum as the transferchamber 115, the storage chamber 250 can be unsealed from the transferchamber 115 such that one or more of the workpiece handling robots canagain access the storage chamber 250.

The workpiece handling robot 150 can be configured to transferreplaceable parts among the storage chamber 250 and the variousprocessing stations for automated replacement of replaceable partswithout breaking vacuum. For example, the workpiece handling robot 150can be used to transfer replaceable parts from the first process chamber120 or the second process chamber 130 to the storage chamber 250. Theworkpiece handling robot 150 can also be used to transfer replaceableparts from the storage chamber 250 to the first process chamber 120 orthe second process chamber 130. In certain embodiments the workpiecehandling robot 150 can retrieve a used replaceable part from one of theprocessing stations in the first process chamber 120 and/or secondprocess chamber and transfer the used part to the storage chamber 250.The workpiece handling robot 150 can also retrieve a new replaceablepart from the storage chamber 250 and transfer the new replaceable partto one of the processing stations of either the first process chamber120 or the second process chamber 130.

The workpiece handling robot can be coupled a controller, such that thecontroller can be used to control the workpiece handling robot fortransferring new or used replaceable parts to and from the storagechamber and process chambers 120 and 130. The controller can beconfigured to control motion of the workpiece handling robot 150according to a robotic arm motion pattern 280 (shown in FIG. 6) foraccessing the one or more processing stations of the first processchamber 120 or the second process chamber 130.

Referring now to FIG. 2, the processing system 200 can includeadditional process chambers, including a third process chamber 170 andfourth process chamber 180. The third process chamber 170 is disposed inlinear arrangement with the first process chamber 120 and the fourthprocess chamber 180 is disposed in linear arrangement with the secondprocess chamber 130 such that the third process chamber 170 and thefourth process chamber 180 are disposed on opposing sides of thetransfer chamber 195.

The third process chamber 170 and the fourth process chamber 180 can beused to perform any of a variety of workpiece processing on theworkpieces, such as vacuum anneal processes, thermal treatment process,surface treatment processes, dry strip processes, dry etch processes,deposition processes, and other processes. In some embodiments, one ormore of the third process chamber 170 and the fourth process chamber 180can include plasma based process sources such as, for example,inductively coupled plasma (ICP) sources, microwave sources, surfacewave plasma sources, ECR plasma sources, and capacitively coupled(parallel plate) plasma sources. In particular embodiments, the focusrings can be used in plasma processing sources used to provide a direction plasma etch process.

As illustrated, each of the third process chamber 170 and fourth processchamber 180 includes a pair of processing stations in side-by-sidearrangement so that a pair of workpieces can be simultaneously exposedto the same process. More particularly, the third process chamber 170can include a first processing station 172 and a second processingstation 174 in side-by-side arrangement. The fourth process chamber 180can include a first processing station 182 and a second processingstation 184 in side-by-side arrangement. Each processing station caninclude a workpiece support (e.g., a pedestal) for supporting aworkpiece during processing. In some embodiments, each processingstation can share a common pedestal with two portions for supporting aworkpiece. In some embodiments, the workpiece support can include apedestal assembly including a baseplate, an electrostatic chuckconfigured to support the workpiece and a replaceable part. Thereplaceable part can include a focus ring arranged relative to theelectrostatic chuck such that at least a portion of the focus ring atleast partially surrounds a periphery of the workpiece when theworkpiece is positioned on the electrostatic chuck. In some embodiments,the third process chamber 170 and/or the fourth process chamber 180 canbe selectively sealed off from the transfer chamber 115 for processing.

To transfer workpieces to the third process chamber 170 and secondprocess chamber 180, the system 200 can further include a transferposition 162 and a second workpiece handling robot 190. The transferposition 162 can be a part of the transfer chamber 162 or can be aseparate chamber. The transfer position 162 can include a support column160 for supporting a plurality of workpieces in a stacked arrangementand/or side-by-side arrangement. For instance, the support column 160can include a plurality of shelves configured to support workpieces in astacked vertical arrangement. The first workpiece handling robot 150 canbe configured to transfer workpieces from the workpiece column 110, thefirst process chamber 120, or the second process chamber 130 to theworkpiece column 160 in the transfer position 162. A second workpiecehandling robot 190 can be configured to transfer workpieces from thesupport column 160 in the transfer position 162 to the processingstations in the third process chamber 170 and/or the fourth processchamber 180. The workpiece handling robot 190 can also transferworkpieces from the third process chamber 170 to the fourth processchamber 180.

As shown in FIG. 2, the workpiece processing system 200 can include astorage chamber 250 for storing new and/or used replaceable parts (e.g.,focus rings) coupled to the transfer chamber. The storage chamber ismounted to a rear side of a transfer chamber. The workpiece handlingrobots 150 and 190 can be configured to transfer replaceable parts amongthe various transfer positions and processing stations for automatedreplacement of replaceable parts without breaking vacuum. In someembodiments, the storage chamber 250 can store test workpieces.

To transfer replaceable parts between the first process chamber 120,second process chamber 130 and the storage chamber 250, the system 200can utilize the second workpiece handling robot 190 to transfer new orused replaceable parts from the storage chamber 250 to the supportcolumn 160 in the transfer position 162. The transfer position 162 canbe a part of the transfer chamber 162 or can be a separate chamber. Thetransfer position 162 can include a support column 160 for supporting aplurality of replaceable parts in a stacked arrangement. For instance,the support column 160 can include a plurality of shelves configured tosupport replaceable parts in a stacked vertical arrangement.Accordingly, in some embodiments, the support column 160 is configuredsuch that it can support both workpieces and replaceable parts in astacked arrangement. The first workpiece handling robot 150 can beconfigured to transfer replaceable parts from the support column 160 tothe side-by-side processing stations 122 and 124 of the first processchamber 120 or the side-by-side processing stations 132 and 134 of thesecond process chamber 130. The second workpiece handling robot 190 canbe configured to transfer replaceable parts from the support column 160in the transfer position 162 to the side-by-side processing stations 172and 174 in the third process chamber, the side-by-side processingstations 182 and 184 in the fourth process chamber 180, and/or thestorage chamber 250.

For removing used replaceable parts or providing new replaceable partsto one or more processing stations, the workpiece handling robots 150and 190 can utilize a robotic arm motion pattern. For example, acontroller can be utilized to control the motions of end effector on thearm of the workpiece handling robots 150 and 190 to control the motionof the end effector when accessing a processing station to transfer areplaceable part. The workpiece handling robot 150 can utilize therobotic arm motion pattern to access the processing stations 122, 124,132, and 134. The workpiece handling robot 190 can utilize the roboticarm motion pattern to access the processing stations 172, 174, 182, and184.

The processing system 200 includes four process chambers 120, 130, 170,and 180 and can be configured to simultaneously process up to eightworkpieces at a time. Additional process stations can be added in linearfashion to provide additional processing capability. For instance, afifth process chamber can be added in linear arrangement with the thirdprocess chamber 170. A sixth process chamber can be added in lineararrangement with the fourth process chamber 180. An additional transferposition and workpiece handling robot can be used to transfer workpiecesto and from the fifth and sixth process chambers. Additional processingchambers can be included by extending the processing system in linearfashion in this manner.

In certain embodiments, the workpiece storage chamber can be located atother locations within the processing system without deviating from thescope of the present disclosure. For instance, in some embodiments, theworkpiece storage chamber could be located above or below a transferposition (e.g., transfer position 162 of processing system 200). Inaddition, one or more of the processing chambers of a workpieceprocessing system (e.g., processing stations 120, 130, 170 or 180 ofprocessing system 200) can be replaced with a storage chamber for newand/or used replaceable parts according to example embodiments of thepresent disclosure.

In other embodiments, the storage chamber 250 can be located at otherlocations within the processing system without deviating from the scopeof the present disclosure. For example, the storage chamber could bedisposed on one or more of the process chambers 120, 130, 170, and/or180. The storage chamber could also be located above or below a transferposition (e.g., transfer position 162 of processing system 200). Inaddition, one or more of the processing chambers of a workpieceprocessing system (e.g., processing stations 120, 130, 170 or 180 ofprocessing system 200) can be replaced with a storage chamber for newand/or used replaceable parts according to example embodiments of thepresent disclosure.

FIG. 3 depicts an example transfer mechanism 260 mounted to a processingchamber of a workpiece processing system 200 according to exampleembodiments of the present disclosure. The transfer mechanism 260 can becoupled directly to the processing chamber 130. In other embodiments,the transfer mechanism 260 can be coupled to any of the processingchambers including 120, 130, 170, and/or 180. As shown, the transfermechanism 260 can include a replaceable part storage location 262 (e.g.,shelves) that can be used to store used and new replaceable parts (e.g.,focus rings). The transfer mechanism 260 can include robotics 270configured to transfer replaceable parts to its proper position in theprocessing station.

FIG. 4 depicts a side view of an example support column 160 in atransfer position 162 according to example embodiments of the presentdisclosure. As shown, the support column 160 can include a plurality ofshelves 161. Each shelf 161 can be configured to support a workpiece 163so that a plurality of workpieces 163 can be arranged on the supportcolumn in a vertical/stacked arrangement. Each shelf 161 can also beconfigured to support a replaceable part 165 so that a plurality ofreplaceable parts 165 can be arranged on the support column 160 in avertical/stacked arrangement. Accordingly, the shelves 161 of thesupport column 160 are configured such that they can support bothworkpieces 163 and replaceable parts 165. In certain embodiments, thereplaceable part 165 can have a larger diameter as compared to theworkpiece 163. Accordingly, the shelves 161 are configured such thatthey can support a replaceable part 165 having a larger diameter than aworkpiece 163. In certain embodiments, the replaceable part can includea focus ring. Focus rings utilized in the systems provided herein canhave a larger diameter as compared to workpieces. Accordingly, thesupport column 160 is configured such that it can support bothworkpieces and focus rings having larger diameters.

In some embodiments, the transfer position can have an opening oraperture that passes all the way through the transfer position so thatworkpiece handling robots can transfer workpieces and or replaceableparts using a direct transfer between robots.

FIG. 5 depicts a side view of an example workpiece column 110 accordingto example embodiments of the present disclosure. As shown, theworkpiece column 110 can include a plurality of shelves 111. Each shelf111 can be configured to support a workpiece 113 so that a plurality ofworkpieces 113 can be arranged on the workpiece column 110 in a verticalstacked arrangement.

In some embodiments, alternative approaches to the delivery ofreplaceable parts in a workpiece processing system can be used withoutdeviating from the scope of the present disclosure. For example,additional transfer mechanism (e.g,, robots, shuttle mechanisms,multi-axis robotics) can be mounted to a process chamber to transferreplaceable parts into and out of the process chamber.

FIG. 6 depicts an example robotic arm motion pattern according toexample embodiments of the present disclosure. As shown, the system 100includes a workpiece handling robot 150 having an arm with an endeffector 500. As shown in FIG. 6, the end effector 500 can be movedwithin the system 100 according to multiple directional movements. Forexample, the end effector 500 can be located inside the transfer chamber115. When it is time to retrieve a used replaceable part 165 from one ofthe side-by-side processing stations (122 or 124, as shown), the endeffector 500 can move into one of the processing stations according to arobotic arm motion pattern 280.

The robotic arm motion pattern 280 can include extending in a firstdirection for a first period of time, extending in a second directiongenerally lateral to the first direction for a second period of time,and extending in a third direction that is different from the firstdirection and second direction for a third period of time. As shown, therobotic arm motion pattern 280 can be utilized to place the end effector500 into one of the processing stations 122 or 124.

In some embodiments the robotic arm motion pattern can include extendingthe end effector 500 in a first direction for a first period of timesuch that the end effector enters the processing chamber 120.Accordingly, in some embodiments, extending the end effector 500 in thefirst direction moves the end effector from the transfer chamber 115into the process chamber 120, but does not place the end effector 500within one of the side-by-side processing stations 122, 124. The endeffector 500 can then be moved according to a second direction that isgenerally lateral to the first direction in order to place the endeffector 500 within one of the side-by-side processing chambers 122,124. As used herein, “generally lateral” or “lateral to” refers towithin about 45° of perpendicular to the first direction. In someembodiments, the second direction can range from about 10° to about 70°,such as 20° to about 60°, such as 30° to about 50°, of perpendicular tothe first direction. The end effector 500 can then be moved in a thirddirection to ensure proper placement of the end effector 500 in theprocessing station 122 such that retrieval of a used replaceable partcan be accomplished. In some embodiments, the third direction can bewithin 30° or less of perpendicular to the first direction. In someembodiments, the end effector 500 can also be removed from theprocessing station 122 according to the same robotic arm motion pattern,For example, the end effector 500 can be retracted back into thetransfer chamber 115 according to the same robotic arm motion pattern280.

In certain embodiments, the end effector 500 can have a new replaceablepart 165 thereon. For example, the end effector 500 can retrieve a newreplaceable part 165 from either the support column 160 or the storagechamber 250. The end effector 500 having the new replaceable part 165thereon can then place the new replaceable part 165 within theprocessing station 122 according to the example robotic arm motionpattern provided herein. For example, the end effector can be moved in afirst direction for a first period of time to access the process chamber120, moved in a second direction lateral to the first direction for asecond period of time to access one of the side-by-side processingstations 122, and moved in a third direction different from the firstdirection and second direction for a third period of time in order toensure proper placement of the new replaceable part 165 in one of theside-by-side processing stations 122, 124.

The robotic arm motion pattern 280 disclosed herein can be utilized byone or more workpiece handling robots of the system. For example,workpiece handling robots 150 and 190 can both be coupled to acontroller capable of executing the robotic arm motion pattern 280described herein. The robotic arm motion pattern 280 can be utilized byworkpiece handling robots 150 and 190 to access any of the side-by-sideprocessing stations 122, 124, 132, 134, 172, 174, 182, and 184 of therespective process chambers 120, 130, 170 and 180, disclosed herein.

In some embodiments, the workpiece handling robots can be configured totransfer workpieces and replaceable parts using a scissor motion. Forexample, the workpiece handling robot 150 can simultaneously transferthe workpieces from the workpiece column in the loadlock chamber 114 tothe two side-by-side processing stations 122 and 124 in the firstprocess chamber 120 using, for instance, a scissor motion. Similarly,the workpiece handling robot 150 can simultaneously transfer workpiecesfrom the workpiece column 110 in the loadlock chamber 114 to the twoside-by-side processing stations 132 and 134 in the second processchamber 130 using, for instance, a scissor motion. The workpiecehandling robot 190 can simultaneously transfer the workpieces from thesupport column 160 in the transfer position 162 to the two side-by-sideprocessing stations 172 and 174 in the third process chamber 170 using,for instance, a scissor motion. The workpiece handling robot 190 cansimultaneously transfer the workpieces from the support column 160 inthe transfer position 162 to the two side-by-side processing stations182 and 184 in the fourth process chamber 180 using, for instance, ascissor motion.

In some embodiments, a controller can be configured to adjust motion ofthe end effector to transfer replaceable parts focus rings) based atleast in part data received from one or more sensors (e.g., sensorsassociated with automated wafer centering system). For instance, opticalsensor(s) can be used to monitor the motion of a replaceable part duringthe motion pattern. To ensure the proper placement of the replaceablepart, the control can adjust the motion pattern in real time as theworkpiece handling robot is transferring the replaceable part to providefor proper placement of the replaceable part with reduced error.

In some embodiments, one or more sensors can be used to determine theposition of a replaceable part after being transferred into a processchamber by the workpiece handling robot. The sensors can include, forinstance, one or more optical sensors. A controller can be configured tocontrol the workpiece handling robot to adjust the position of thereplaceable part when sensor measurements indicate the replaceable parthas been positioned incorrectly (e.g., not concentrically with theworkpiece support).

FIG. 7 depicts a flow diagram of one example method (300) according toexample aspects of the present disclosure. The method (300) includes amethod for replacing replaceable parts in a system for processingworkpieces. The method (300) will be discussed with reference to thesystem of FIG. 2 by way of example. The method (300) can be implementedin any suitable processing apparatus. FIG. 7 depicts steps performed ina particular order for purposes of illustration and discussion. Those ofordinary skill in the art using the disclosures provided herein, willunderstand that various steps of any of the methods described herein canbe omitted, expanded, performed simultaneously, rearranged, and/ormodified in various ways without deviating from the scope of the presentdisclosure. In addition, various steps (not illustrated) can beperformed without deviating from the scope of the present disclosure.

At (302) the method can include removing a used replaceable part 165from a processing station 122, 124, 132, 134, 172, 174, 182, or 184. Theworkpiece handling robot 150 can move the end effector 500 thereon fromthe transfer chamber 115 to the process chamber 120 and into theprocessing station 122 according to a robotic arm motion pattern. Therobotic arm motion pattern can include extending the end effector 500 ina first direction for a first period of time, extending the end effector500 in a second direction lateral to the first direction for a secondperiod of time, and extending the end effector 500 in a third directiondifferent from the first direction and the second direction for a thirdperiod of time. Once the end effector 500 is in correct placement withinthe processing chamber 122, the replaceable part can be placed on theend effector 500. In some embodiments, the end effector 500 can lift thereplaceable part 165 from a raised location within the processingstation 122. For example, a plurality of pins connected to a liftingmechanism can be used to raise the replaceable part 165 from itsprocessing location to a raised position. Once in a raised position, theend effector 500 can easily be placed under the replaceable part 165 forlifting the replaceable part 165 from the one or more pins.

Once the replaceable part 165 is placed on the end effector 500, the endeffector 500 can be retracted back into the transfer chamber 115 via therobotic arm motion pattern. For example, the end effector 500 having theused replaceable part 165 thereon can be retracted according to a thirddirection different from the first direction and second direction for athird period of time, retracted according to a second direction lateralto the first direction for a second period of time, and retractedaccording to a first direction for a first period of time until the endeffector 500 having the replaceable part 165 thereon is located backwithin the transfer chamber 115.

At (304) the method includes transferring the replaceable part to thestorage chamber. Transferring the replaceable part 165 to the storagechamber 250 can include utilizing the workpiece handling robot 150 toplace the used replaceable part 165 on the support column 160 in thetransfer position 162. For example, the used replaceable part 165 can beplaced on one of the shelves 161 located in the support column 160 in astacked arrangement. The workpiece handling robot 190 can then removethe used replaceable part 165 from the shelf 161 from the support column160 and transfer the replaceable part 165 to the storage chamber 250.The workpiece handling robot 190 can place the used replaceable part 165on one of the shelves located within the storage chamber 250.

At (306) the method includes removing a new replaceable part fr©m thestorage chamber. The workpiece handling robot 190 can remove a newreplaceable part 165 from one of the shelves in the storage chamber 250and place the new replaceable part on one of the shelves 161 within thesupport column 160 in the transfer position 162 in a stackedarrangement.

At (308) the method includes transferring the new replaceable part to aprocessing station. Once the new replaceable part 165 is placed on oneof the shelves 161 in the support column 160, workpiece handling robot150 can access the support column 160 to remove the new replaceable part165. Workpiece handling robot 150 can then be utilized to place the newreplaceable part inside one of the side-by-side processing stationsaccording to the robotic arm motion pattern. For example, the workpiecehandling robot 150 can move the end effector 500 having the newreplaceable part 165 thereon from the transfer chamber 115 to theprocess chamber 120 and into the processing station 122 according to arobotic arm motion pattern. The robotic arm motion pattern can includeextending the end effector 500 in a first direction for a first periodof time, extending the end effector 500 in a second direction lateral tothe first direction for a second period of time, and extending the endeffector 500 in a third direction different from the first direction andthe second direction for a third period of time. Once the end effector500 is in correct placement within the processing chamber 122, the newreplaceable part 165 can be deposited within the processing station inany suitable manner. For example, in one embodiment, the replaceablepart 165 (e.g. focus ring) can be placed on a plurality of pins in araised position. Once securely placed on the pins, the pins can belowered to place the replaceable part in a desired location within theprocessing station 122, such that further workpiece processing can beaccomplished.

Once the replaceable part 165 is placed within the processing station122, the end effector can be retracted back into the transfer chamber115 via the robotic arm motion pattern 280. For example, the endeffector 500 can be retracted according to a third direction differentfrom the first direction and second direction for a third period oftime, retracted according to a second direction lateral to the firstdirection for a second period of time, and retracted according to afirst direction for a first period of time until the end effector 500 islocated back within the transfer chamber 115.

In some embodiments, the workpiece handling robot can remove a testworkpiece from the storage location. The test workpiece can betransferred to the processing station. A test process can be performedwith the test workpiece, Data collected during the test process and/orcharacteristics of the test workpiece can be monitored to determineproper placement of the replaceable part.

Advantageously, the method (300) can be performed to allow for theautomated replacement of replaceable parts without having to breakvacuum of the processing system, Further, the method (300) allows forreplacement of replaceable parts utilizing workpiece handling robotsthat are capable of transferring both workpieces and replaceable partsthat are larger than the workpieces. Also, the robotic arm motionpattern allows for the end effector of the workpiece handling robot toenter one of the side-by-side processing stations, such that areplaceable part can be replaced.

FIG. 8 depicts a flow diagram of one example method (400) according toexample aspects of the present disclosure. The method (400) includes amethod for processing workpieces. The method (400) will be discussedwith reference to the system of FIG. 2 by way of example. The method(400) can be implemented in any suitable processing apparatus. FIG. 8depicts steps performed in a particular order for purposes ofillustration and discussion. Those of ordinary skill in the art usingthe disclosures provided herein, will understand that various steps ofany of the methods described herein can be omitted, expanded, performedsimultaneously, rearranged, and/or modified in various ways withoutdeviating from the scope of the present disclosure. In addition, varioussteps (not illustrated) can be performed without deviating from thescope of the present disclosure.

At (402), the method includes transferring a plurality of workpieces toa workpiece column in a loadlock chamber. For instance, a plurality ofworkpieces can be transferred from a front end portion of processingsystem to a workpiece column 110 in a loadlock chamber 114. Theworkpieces can be transferred to the workpiece column 110, for instance,using one or more robots associated with the front end portion of theprocessing system.

At (404) the method includes using a workpiece handling robot totransfer workpieces from the workpiece column to the processing stationsin the first process chamber and/or second process chamber. Forinstance, the workpiece handling robot 150 can transfer two workpiecesto processing station 122 and processing station 124 respectively inprocess chamber 120.

At (406) the method includes performing a first treatment process on theplurality of workpieces in the first process chamber and/or secondprocess chamber. The first treatment process can include, for instance,an anneal process, a thermal treatment process, a surface treatmentprocess, a dry strip processes, a dry etch process, a deposition processor other process.

At (408), the method can include transferring, with the workpiecehandling robot a plurality of workpieces to a transfer position.Workpiece handling robot 150 can transfer two workpieces to processingstation 122 and processing station 124 respectively in process chamber120. In some embodiments, the workpiece handling robot 150 can transferworkpieces to a workpiece column 160 located at a transfer position 162.

At (410), the method can include transferring, with a second workpiecehandling robot 190 disposed in the transfer chamber, the plurality ofworkpieces from the transfer position to at least two processingstations in a third process chamber and/or fourth process chamber. Thethird process chamber can be disposed in linear arrangement with thefirst process chamber and the fourth process chamber can be disposed inlinear arrangement with the second process chamber. For instance,workpiece handling robot 190 can transfer two workpieces from workpiececolumn 160 in the transfer position 162 to processing station 172 andprocessing station 174 respectively in process chamber 170.

At (412) the method can include performing a second treatment process onthe plurality of workpieces in the third process chamber and/or fourthprocess chamber. The third treatment process can include, for instance,an anneal process, a thermal treatment process, a surface treatmentprocess, a dry strip processes, a dry etch process, a deposition processor other process.

At (414), the method can include transferring, by the workpiece handlingrobot 190, the plurality of workpieces back to the transfer position.For instance, workpiece handling robot 190 can transfer workpieces fromthe process chamber 170 and/or the process chamber 180 to a workpiececolumn 160 located at the transfer position 162.

At (416), the method can include transferring the processed workpiecesback to the workpiece column in the loadlock chamber. For instance,workpiece handling robot 150 can transfer two workpieces from the firstprocess chamber 120 and/or the second process chamber 130. In someembodiments, workpiece handling robot 150 can transfer two workpiecesfrom the transfer position 162 to the workpiece column in the loadlockchamber. One or more robots located in a front end of the processingsystem can then transfer to processed workpieces to, for instance, acassette.

As shown. (404)-(416) can be repeated according to the number ofworkpieces desired for processing. After the desired number ofworkpieces have been processed or another trigger condition occurs, themethod can include replacing replaceable parts (418) in the processingstations. For example, replaceable parts, such as focus rings, can needto be replaced after exposure to a certain number of processingtreatments. Replacing the replaceable parts (418) can be accomplished byway of method 300 provided herein. Accordingly, the present systems andmethods allow for the automated processing of workpieces and theautomated replacement of replacement parts without having to break thevacuum or alter the process pressure of the system.

Turning now to FIGS. 9-12B, example embodiments of an end effector aredepicted according to example embodiments of the present disclosure.More particularly, FIG. 9 depicts a perspective view of an example endeffector for use within the systems described above. FIGS. 10A-10Bdepict a first configuration of support elements on the end effector ofFIG. 9 for supporting an example workpiece and focus ring. Moreover,FIGS. 11A-11B depict a second configuration of support elements on theend effector of FIG. 9 for supporting an example workpiece and focusring. Additionally, FIGS. 12A-12B depict a partial perspective view of athird configuration of support elements on the end effector of FIG. 9for supporting an example workpiece and focus ring.

As shown in FIG. 9, the end effector 500 described above with referenceto the system 100, 200 can extend along a longitudinal axis 502 betweena proximal end 504 and a distal end 506, and between an upper surface500US and a lower surface 500LS along a vertical direction V1. The endeffector 500 is generally symmetric about the longitudinal axis 502. Theend effector 500 includes an arm portion 508 and a spatula portion 510.The arm portion 508 generally extends between a first arm end 512 and asecond arm end 514 along the longitudinal axis 502, with the first armend 512 being at or adjacent to the proximal end 504. Similarly, thespatula portion 510 extends between a first spatula end 516 and a secondspatula end 518. The first spatula end 516 is at or adjacent to thesecond arm end 514 and the second spatula end 518 is at or adjacent tothe distal end 506. The end effector 500 is configured to be attached toor otherwise actuatable by a robot (e.g., workpiece handling robot 150,190) by its arm portion 508, such that the spatula portion 510 can beguided under a raised workpiece or replaceable part (e.g., a focus ring)

In general, the end effector 500 can be configured to separately supportworkpieces and replaceable parts, where the workpieces have a differentdiameter than the replaceable parts. For example, as shown in FIGS. 10A,11A, and 12A, the end effector 500 can be configured to support aworkpiece 163 having a diameter 163D and a focus ring 165 having aninner diameter 165ID and an outer diameter 165OD. In some embodiments,the diameter 163D of the workpiece 163 is smaller than the outerdiameter 165OD of the focus ring 165. The diameter 163D of the workpiececan be larger than the inner diameter 165ID of the focus ring 165. Tokeep the workpiece 163 and replaceable part secure when being separatelymoved by the end effector 500, one or more support pads or elements canbe provided on the upper surface of the effector 500.

In one embodiment, such as the embodiment shown in FIGS. 10A and 10B, itis desirable to have separate support elements for workpieces and focusrings to prevent cross-contamination from used focus rings. For example,first support elements SE1 are provided to support the workpiece 163 andsecond support elements SE2 are provided to support the focus ring 165.At least one of the first support elements SE1 is positioned on the armportion 508 and at least one other of the first support elements SE1 ispositioned on the spatula portion 510. Similarly, at least one of thesecond support elements SE2 is positioned on the arm portion 508 and atleast one other of the second support elements SE2 is positioned on thespatula portion 510. In one embodiment, two separate first supportelements SE1 are provided on the arm portion 508 and on the spatulaportion 510, where the support elements SE1 are similar or the same inshape. Further, two separate second support elements SE2 are provided onthe spatula portion 510 and one elongated second support element SE2 isprovided on the arm portion 508. However, any suitable number and shapeof support elements SE1, SE2 can instead be provided on the arm portion508. For instance, one, three, or more first support elements SE1 or twoor more second support elements SE2 can be provided on the arm portion508. Further, the first support element(s) SE1 on the arm portion 508can instead have an elongated shape like the second support element SE2shown in FIG. 10A. Additionally, the second support element(s) SE2 onthe arm portion 508 can instead have the same shape as the secondsupport element(s) SE2 on the spatula portion 510.

The support elements SE1, SE2 are spaced apart such that the firstsupport elements SE1 can only support workpieces and such that thesecond support elements SE2 can only support focus rings. For instance,in FIG. 10B, the first support elements SE1 are spaced apart by adistance D1 along the longitudinal axis 502, the second support elementsSE2 are spaced apart by a distance D2 along the longitudinal axis 502,and the support elements SE1, SE2 on the arm portion 508 and the supportelements SE1, SE2 on the spatula portion 510 are respectively spacedapart by a third distance D3. However, in some embodiments the supportelements SE1, SE2 on the arm portion 508 can instead be spaced apart bya different distance than the support elements SE1, SE2 on the spatulaportion 510. The distances D1, D2, and D3 are selected such that, when aworkpiece is supported on the first support elements SE1, the workpiecedoes not contact the second support elements SE2. Similarly, when afocus ring is supported on the second support elements SE2, the focusring does not contact the first support elements SE1,

In some embodiments, the second support elements SE2 on the spatulaportion 510 are positioned closer to the distal end 506 of the endeffector 500 than the first support elements SE1 on the spatula portion510. Similarly, in one embodiment, the second support elements SE2 onthe arm portion 508 are positioned closer to the proximal end 504 of theend effector 500 than the first support elements SE1 on the arm portion508.

Further, in some embodiments, the first support elements SE1 on thespatula portion 510 are positioned further from the longitudinal axis502 than the second support elements SE2 on the spatula portion 510. Forinstance, the first support elements SE1 on the spatula portion 510 arespaced apart from the axis 502 by a first distance L1 in a directiongenerally perpendicular to the axis 502, and the second support elementsSE2 on the spatula portion 510 are spaced apart from the axis 502 by asecond distance L2 in the direction generally perpendicular to the axis502, Where the first distance L1 is greater than the second distance L2.

In another embodiment, such as the embodiment shown in FIGS. 11A and11B, the risk of cross-contamination between used focus rings andworkpieces is relatively low, such that one or more support elements canbe configured to support both workpieces and focus rings. For instance,in addition to the first support elements SE1 and the second supportelements SE2 on the spatula portion 510, a common or shared supportelement CSE1 is provided on the arm portion 508. The shared supportelement CSE1 is configured to, together with the first support elementsSE1, support the workpiece 163 and, together with the second supportelements SE2, support the focus ring 165.

Similar to FIG. 10B, in FIG. 11B, the first and second support elementsSE1, SE2 are spaced apart such that the first support elements SE1 and afirst contact area CA1 of the shared support element CSE1 can onlysupport workpieces, and such that the second support elements SE2 and asecond contact area CA2 of the shared support element CSE1 can onlysupport focus rings. For example, the first support elements SE1 and thefirst contact area CA1 are spaced apart by a distance D1 along thelongitudinal axis 502, the second support elements SE2 and the secondcontact area CA2 are spaced apart by a distance D2 along thelongitudinal axis 502, and the support elements SE1, SE2 on the armportion 508 and the contact areas CA1, CA2 on the spatula portion 510are respectively spaced apart by a third distance D3. However, in sonicembodiments the contact areas CA1, CA2 on the arm portion 508 caninstead be spaced apart by a different distance than the supportelements SE1, SE2 on the spatula portion 510. The distances D1, D2, andD3 are selected such that, when a workpiece is supported on the firstsupport elements SE1 and the first contact area CA1, the workpiece doesnot contact the second support elements SE2 or the second contact areaCA2. Similarly, when a focus ring is supported on the second supportelements SE2 and the second contact area CA2, the focus ring does notcontact the first support elements SE1 or the first contact area CA1. Assuch, the first contact area CA1 for supporting the workpiece 163 isseparate from or does not overlap with the second contact area CA2 forsupporting the focus ring 165.

As described above, in some embodiments, the second support elements SE2on the spatula portion 510 are positioned closer to the distal end 506of the end effector 500 than the first support elements SE1 on thespatula portion 510. Similarly, in one embodiment, the second contactarea CA2 is positioned closer to the proximal end 504 of the endeffector 500 than the first contact area CA1 of the shared supportelement CSE1 on the arm portion 508.

Further, in some embodiments, the first support elements SE1 on thespatula portion 510 are positioned further from the longitudinal axis502 than the second support elements SE2 on the spatula portion 510. Forinstance, the first support elements SE1 on the spatula portion 510 arespaced apart from the axis 502 by a first distance Ll in a directiongenerally perpendicular to the axis 502, and the second support elementsSE2 on the spatula portion 510 are spaced apart from the axis 502 by asecond distance L2 in the direction generally perpendicular to the axis502, where the first distance L1 is greater than the second distance L2.

Alternatively, in some embodiments, such as the embodiment shown inFIGS. 12A and 12B, the first and second contact areas CA1, CA2 at leastpartially overlap. For instance, as shown in FIG, 12A, a workpiece and afocus ring separately supported on the end effector 500 are configuredto be supported across a common contact area CCA on the shared supportelement CSE1. For example, as shown in FIG. 12B, the first supportelements SE1 and the common contact area CCA are spaced apart by adistance D1 along the longitudinal axis 502, the second support elementsSE2 and the common contact area. CCA are spaced apart by a distance D2along the longitudinal axis 502, and the support elements SET, SE2 onthe arm portion 508 are spaced apart by a third distance D3′. Thedistances D1, D2, and D3′ are selected such that, when a workpiece issupported on the first support elements SE1 or a focus ring is supportedon the second support elements SE2, the workpiece and the focus ringcontact the common contact area CCA. As such, the shared support elementCSE1 can be smaller when the common contact area CCA is allowable thanif separate contact areas such as the contact areas CA1, CA2) are used.

The embodiment of the end effector 500 shown in FIGS. 12A and 12B canotherwise be configured the same as the embodiment of the end effector500 shown in FIGS. 11A and 11B. For instance, as described above, insome embodiments, the second support elements SE2 on the spatula portion510 are positioned closer to the distal end 506 of the end effector 500than the first support elements SE1 on the spatula portion 510. Further,in some embodiments, the first support elements SE1 on the spatulaportion 510 are positioned further from the longitudinal axis 502 thanthe second support elements SE2 on the spatula portion 510. Forinstance, the first support elements SE1 on the spatula portion 510 canbe spaced apart from the axis 502 by a first distance in a directiongenerally perpendicular to the axis 502, and the second support elementsSE2 on the spatula portion 510 can be spaced apart from the axis 502 bya second distance in the direction generally perpendicular to the axis502, where the first distance is greater than the second distance.

Referring now to FIGS. 13-17, an example embodiment of an adjustmentassembly for a workpiece processing station described above is depicted.In particular, FIG. 13 depicts a focus ring adjustment assembly of anexample processing system. FIG. 14A depicts a side, sectional view ofthe adjustment assembly shown in FIG. 13 with a focus ring in a loweredposition. Similarly, FIG. 14B depicts a side, sectional view of theadjustment assembly shown in FIG. 13 with a focus ring in a raisedposition. Additionally, FIG. 15A depicts a section view of a firstembodiment of a focus ring for use with the adjustment assembly shown inFIG. 13 and. FIG. 15B depicts a section view of a second embodiment of afocus ring for use with the adjustment assembly shown in FIG. 13.Moreover, FIG. 16 depicts a top-down view of a pin support plate of theadjustment assembly shown in FIGS. 14A-14B. Additionally, FIG. 17depicts a schematic view of an actuating system for the adjustmentassembly shown in FIGS. 14A-14B according to example embodiments of thepresent disclosure.

As described above, a workpiece processing system (e.g., system 100,200) includes a. workpiece support(s) (e.g., station 122, 124, 132, 134)within a process chamber (e.g., 120, 130, 170, 180) that is configuredto support a workpiece (e.g., workpiece 113, 163) during a processtreatment step(s). As shown in FIG. 13, a focus ring 165 is positionedaround a periphery or outer diameter of a workpiece supported on aworkpiece support 163. The focus ring 165 can be used, for instance, toshape the plasma in the vicinity of the workpiece. During plasmaprocessing in a plasma processing chamber, the focus ring 165 can heexposed to plasma and as such is exposed to deposition and erosion. As aresult, the focus ring 165 can need to be periodically replaced in theplasma processing chamber as part of preventative maintenance. A focusring adjustment assembly 600 is provided that allows the focus ring 165to be moved between a working or processing position, in which it is noteasily accessible for removal from the process chamber, and one or moreraised positions. In at least one of the raised positions, the focusring is more easily accessible for removal from the process chamber.

The focus ring adjustment assembly 600 includes a plurality of pins forsupporting the focus ring. For instance, as shown in FIGS. 14A and 14B,the focus ring 165 is supported by pins 602 (only one of which isshown). Each pin 602 extends between a proximal end 602P and a distalend 602D, where the distal end 602D is configured to contact the focusring 165. As will be described below in greater detail, the pins 602 canbe configured to selectively contact a portion of the focus ring 165(e.g., in a groove) such that lateral movement of the ring 165 on thepins 602 is at least partially prevented or reduced. The assembly 600further includes a lifting mechanism which can be used to raise or lowerthe pins 602 to raise the focus ring 165 from a processing position to araised position or lower the focus ring 165 into a processing position,respectively. In the processing position, the pins 602 may no longercontact the focus ring and the focus ring 165 may be supported by apedestal (e.g., step structure in the pedestal). As will be described ingreater detail below, the assembly 600 further includes floatingcouplings 604 slidably received within a pin support plate 606, wherethe proximal end 602P of each pin 602 is coupled to a respective one ofthe floating couplings 604, and where the pin support plate 606 ismovable to raise or lower the pins 602,

In one embodiment, as shown in FIG. 15A, the focus ring 165A has astepped cross-sectional profile. More particularly, the focus ring 165Aextends between an upper side 165US and a lower side 165LS along thevertical direction V1, where the lower side 165LS has a first surfaceportion P1, a second surface portion P2, and a transition portion Tibetween the first and second surface portions P1, P2. The first surfaceportion P1 is vertically above the second surface portion P2. In someembodiments, the first surface portion P1 is radially outside of thesecond surface portion P2. The distal end 602D of the pin 602 isconfigured to selectively contact the first surface portion P1 (e.g.,one or more grooves in the first surface portion P1) such that the focusring 165A is prevented from laterally sliding and becoming at leastpartially unseated from the pins 602. Additionally, the first surfaceportion P1 is generally planar such that the distal end 602D of the pin602 makes full contact with the first surface portion P1 (e.g., one ormore grooves or slots in the first surface portion P1).

In some embodiments, the focus ring has three backside radial slots toreceive the pin(s) 602. This configuration can fix the position of thefocus ring 165A, allowing for accurate centering of the focus ring on tothe pedestal and can also prevent lateral movement. The backside radialslots can also allow for thermal expansion of the focus ring while beingsupported by the pins 602. In some embodiments, the focus ring caninclude a backside annular groove. The backside annular groove extendsannularly around the backside surface of the focus ring. The backsideannular groove can include an outer diameter and an inner diameter. Thepin(s) 602 may be configured to contact the outer diameter. Duringthermal expansion of the focus ring, the pin(s) 602 may no longercontact the outer diameter but my slide radially in the groove in adirection towards the inner diameter to accommodate thermal expansion ofthe focus ring.

In some embodiments, as shown in FIG. 15B, the focus ring 165B has agrooved cross-sectional profile. More particularly, the focus ring 165Bextends between an upper side 165US′ and a lower side 165LS′ along thevertical direction V1, and between an inner surface 165IS′ and an outersurface 165OS′ along a radial direction, where a groove G1 is recessedinto the lower side 165LS′ such that it is spaced apart from the innerand outer surfaces 165IS′, 165OS′. The groove G1 can be an annulargroove that extends all the way annularly around the focus ring 165B.The distal end 602D of the pin 602 is configured to selectively contactat least a portion of the groove G1. The groove G1 defines a firstgroove portion extending a first distance VD1 from the lower side 165LS′and a second groove portion extending a second distance VD2 from thelower side 165LS′. The second distance VD2 is less than a thickness ofthe focus ring 165B defined between the upper and lower sides 165US′,165LS′ along the vertical direction V1. A first surface portion P1′ ispositioned at the first distance VD1 from the lower side 165LS′, asecond surface portion P2′ is positioned at the second distance VD2 fromthe lower side 165LS′, a first transition portion T1′ extends betweenthe first surface portion P1′ and the lower side 165LS′, and a secondtransition portion T2′ extends between the first and second surfaceportions P1′, P2′. The second surface portion P2′ is vertically abovethe first surface portion P1′. The distal end 602D of the pin 602 isconfigured to selectively contact at least one of the second surfaceportion P2′ or the second transition portion T2′. The second surfaceportion P2′ is generally planar such that the distal end 602D of the pin602 can fully contact the second surface portion P2′. Further, in someembodiments, the pin 602 has a main body portion MB extending betweenits proximal and distal ends 602P, 602D and a flange portion FPextending outwardly from the main body portion MB at a distance OH1offset from the distal end 602D, The flange portion FP has a diameter602D2 that is greater than the diameter 602D1 of the main body portionMB of the pin 602. The flange portion FP is configured to contact atleast one of the first surface portion P1′ or the first transitionportion T1′. As such, the focus ring 165B is prevented from laterallysliding and becoming at least partially unseated from the pin 602.

Additionally, or alternatively, in some embodiments, the shape of thegroove G1 of the focus ring 165B, the shape of the pin(s) 602, or bothare configured such that rotation of the pin(s) 602 secures or fixes thefocus ring 165B to the pin(s) 602. For instance, rotation of the pin(s)602 through a predetermined locking angle can fix the focus ring 165B tothe pin(s) 602.

A top down view of a suitable pin support plate is shown in FIG. 16. Thepin support plate 606 has a plurality of floating coupling slots 608circumferentially spaced apart around the perimeter of the pin supportplate 606. The slots 608 extend generally radially outwardly from theouter perimeter of the plate 606. However, in some embodiments, theslots 608 can extend radially inwardly from the inner perimeter of theplate 606. Each floating coupling slot 608 is configured to receive arespective one of the floating couplings 604. For example, each floatingcoupling slot 608 has a slot width W1 which is greater than the outerdiameter 604D1 of the floating couplings 604, but smaller than the outerdiameter 604D2 of a flange portion of the floating couplings 604, whichextends outwardly from the outer diameter 604D1 of the floatingcouplings 604. As such, the flange portion of the floating coupling 604can rest on an upper face of the floating coupling slot 608 wheninstalled within the floating coupling slot 608. Such floating couplingslot 608 can thus, allow the pins 602 to move slightly in a horizontalplane laterally along an x-axis and/or a y-axis relative to the focusring 165 or workpiece support.

The pin support plate 606 is configured to be actuated between a loweredposition and one or more raised positions such that the focus ring 165is respectively moved between processing position to one or more raisedpositions. For instance, as shown in FIG. 14A, the pin support plate 606is in its lowered position relative to a main support post 620 fixedwithin the process chamber and a support ring 622 fixed to the mainsupport post 620. In such lowered position of the pin support plate 606,the pins 602 supported on the pin support plate 606 by the floatingcouplings 604 are in their retracted positions such that the focus ring165 is in its processing position and is supported by the workpiecesupport. In some embodiments, the pins 602 can be movable by the pinsupport plate 606 such that the pins 602 do not touch the focus ring 165when in their retracted positions. However, in other embodiments, thepins 602 can remain in contact with the focus ring 165 when in theirretracted positions.

The pin support plate 606 is movable, as will be described in greaterdetail below, into its raised position shown in FIG. 14B relative to themain support post 620 and support ring 622. The pin support plate 606 isvertically higher along the vertical direction in its raised positionthan in its lowered position. As the pin support plate 606 is moved intosuch raised position, the pins 602 supported on the pin support plate606 by the floating couplings 604 are moved along the vertical directioninto their extended positions such that the focus ring 165 is moved intoits raised position above the workpiece support. The focus ring 165 ispositioned vertically higher along the vertical direction V1 when thepins 602 are in their extended positions than when the pins 602 are intheir retracted positions. Once in a raised position, an end effector(e.g., the end effector 500) can easily be placed under the focus ring165 for lifting the focus ring 165 from the one or more pins 602 and outof the chamber.

As shown in FIG. 17, the assembly 600 further includes a plate actuator624 for moving the pin support plate 606. The plate actuator 624 ispositioned exterior to the process chamber and is vacuum sealed. Moreparticularly, the plate actuator 624 has a vacuum sealed housing 626that is coupled to an exterior wall EXT1 of the process chamber and aconnection shaft 628 that extends within the vacuum sealed housing 626through the exterior wall EXT1 of the process chamber. The connectionshaft 628 supports the pin support plate 606 and is movable relative tothe exterior wall EXT1 by an actuator mechanism 632. The actuatormechanism 632 is configured to move the connection shaft 628 between afirst position along the vertical direction associated with the pinsupport plate 606 being in the lowered position, and a second positionalong the vertical direction associated with the pin support plate 606being in the raised position, and/or one or more different verticalpositions. The actuator mechanism 632 can be configured as any suitableactuator for moving the connection shaft 628 between the first andsecond positions. For instance, in some embodiments, the actuatormechanism 632 is configured as a linear actuator, a rotary actuator, andor the like. By positioning the actuator mechanism 632 exterior to theprocess chamber, the mechanism 632 can be serviced or replaced withoutneeding to affect the vacuum of the process chamber.

The focus rings 165 can be configured to be installed in the chamberwith a particular azimuthal orientation relative to the workpiecesupport. Typically, the focus rings 165 are positioned in a storagechamber (e.g., storage chamber 250) to have the proper azimuthalorientation when removed from the storage chamber for installationwithin the process chamber. However, in some embodiments, it isdesirable to further adjust the azimuthal position of the focus rings165. In such embodiments, the storage chamber and/or end effector formoving the focus rings 165 can include one or more features foradjusting an azimuthal position of a focus ring 165.

Referring now to FIG. 18, a plasma processing apparatus 700 is providedaccording to example embodiments of the present disclosure. The plasmaprocessing apparatus 700 can include a processing chamber 701 defining avertical direction V and a lateral direction L. The plasma processingapparatus 700 can include a pedestal 704 disposed within an interiorspace 702 of the processing chamber 701. The pedestal 704 can beconfigured to support a substrate 706, such as a semiconductor wafer,within the interior space 702. A dielectric window 710 is located abovethe pedestal 704 and acts as a ceiling of the interior space 702. Thedielectric window 710 includes a central portion 712 and an angledperipheral portion 714. The dielectric window 710 includes a space inthe central portion 712 for a showerhead 720 to feed process gas intothe interior space 702.

In some implementations, the plasma processing apparatus 700 can includea plurality of inductive elements, such as a primary inductive element730 and a secondary inductive element 740, for generating an inductiveplasma in the interior space 702. The primary inductive element 730 andthe secondary inductive element 740 can each include a coil or antennaelement that when supplied with RF power, induces a plasma in theprocess gas in the interior space 702 of the processing chamber 701. Forinstance, a first RF generator 760 can be configured to provideelectromagnetic energy through a matching network 762 to the primaryinductive element 730. A second RF generator 770 can be configured toprovide electromagnetic energy through a matching network 772 to thesecondary inductive element 740.

While the present disclosure makes reference to a primary inductiveelement and a secondary inductive element, those of ordinary skill inthe art, should appreciate that the terms primary and secondary are usedfor convenience purposes only. The secondary coil can be operatedindependently of the primary coil. The primary coil can be operatedindependently of the secondary coil. In addition, in some embodiments,the plasma processing apparatus can only have a single inductivecoupling element.

In some implementations, the plasma processing apparatus 700 can includea metal shield 752 disposed around the secondary inductive element 740.In this manner, the metal shield 752 separates the primary inductiveelement 730 and the secondary inductive element 740 to reduce cross-talkbetween the primary inductive element 730 and the secondary inductiveelement 740.

In some implementations, the plasma processing apparatus 700 can includea first Faraday shield 754 disposed between the primary inductiveelement 730 and the dielectric window 710. The first Faraday shield 754can be a slotted metal shield that reduces capacitive coupling betweenthe primary inductive element 730 and the process chamber 701. Asillustrated, the first Faraday shield 754 can fit over the angledportion of the dielectric window 710.

In some implementations, the metal shield 752 and the first Faradayshield 754 can form a unitary body 750 for ease of manufacturing andother purposes. The multi-turn coil of the primary inductive element 730can be located adjacent the first Faraday shield 754 of the unitary body750. The secondary inductive element 740 can be located proximate themetal shield 752 of the unitary body 750, such as between the metalshield 752 and the dielectric window 710.

The arrangement of the primary inductive element 130 and the secondaryinductive element 140 on opposite sides of the metal shield 752 allowsthe primary inductive element 730 and secondary inductive element 740 tohave distinct structural configurations and to perform differentfunctions. For instance, the primary inductive element 730 can include amulti-turn coil located adjacent a peripheral portion of the processchamber 701. The primary inductive element 730 can be used for basicplasma generation and reliable start during the inherently transientignition stage. The primary inductive element 730 can be coupled to apowerful RF generator and expensive auto-tuning matching network and canbe operated at an increased RF frequency, such as at about 13.56 MHz. Asused herein, the term “about” refers to a range of values within 20percent of a stated numerical value.

In some implementations, the secondary inductive element 740 can be usedfor corrective and supportive functions and for improving the stabilityof the plasma during steady state operation. Furthermore, since thesecondary inductive element 740 can be used primarily for corrective andsupportive functions and improving stability of the plasma during steadystate operation, the secondary inductive element 740 does not have to becoupled to as powerful an RF generator as the primary inductive element730 and can therefore be designed differently and cost effectively toovercome the difficulties associated with previous designs. As discussedin detail below, the secondary inductive element 740 can also beoperated at a lower frequency, such as at about 2 MHz, allowing thesecondary inductive element 740 to be very compact and to fit in alimited space on top of the dielectric window.

In some implementations, the primary inductive element 730 and thesecondary inductive element 740 can be operated at differentfrequencies. The frequencies can be sufficiently different to reducecross-talk in the plasma between the primary inductive element 730 andthe secondary inductive element 740. For instance, the frequency appliedto the primary inductive element 730 can be at least about 1.5 timesgreater than the frequency applied to the secondary inductive element740. In some embodiments, the frequency applied to the primary inductiveelement 730 can be about 13.56 MHz and the frequency applied to thesecondary inductive element 740 can be in the range of about 1.75 MHz toabout 2.15 MHz. Other suitable frequencies can also be used, such asabout 400 kHz, about 4 MHz, and about 27 MHz. While the presentdisclosure is discussed with reference to the primary inductive element730 being operated at a higher frequency relative to the secondaryinductive element 740, those of ordinary skill in the art, using thedisclosures provided herein, should understand that the secondaryinductive element 740 could be operated at the higher frequency withoutdeviating from the scope of the present disclosure.

In some implementations, the secondary inductive element 740 can includea planar coil 742 and a magnetic flux concentrator 744. The magneticflux concentrator 744 can be made from a ferrite material. Use of amagnetic flux concentrator with a proper coil can give high plasmacoupling and good energy transfer efficiency of the secondary inductiveelement 740 and can significantly reduce its coupling to the metalshield 752. Use of a lower frequency, such as about 2 MHz, on thesecondary inductive element 740 can increase skin layer, which alsoimproves plasma heating efficiency.

In some implementations, the primary inductive element 730 and thesecondary inductive element 740 can carry different functions. Forinstance, the primary inductive element 730 can he used to carry out thebasic functions of plasma generation during ignition and providingenough priming for the secondary inductive element 740. The primaryinductive element 730 can have coupling to both plasma and the groundedshield to stabilize plasma potential. The first Faraday shield 754associated with the primary inductive element 730 avoids windowsputtering and can be used to supply the coupling to the groundedshield.

Additional coils can be operated in the presence of good plasma primingprovided by the primary inductive element 730 and as such, preferablyhave good plasma coupling and good energy transfer efficiency to plasma.A secondary inductive element 740 that includes a magnetic fluxconcentrator 744 provides both a good transfer of magnetic flux toplasma volume and at the same time a good decoupling of the secondaryinductive element 740 from the surrounding metal shield 752. Themagnetic flux concentrator 744 and symmetric driving of the secondaryinductive element 740 further reduces the amplitude of the voltagebetween coil ends and surrounding grounded elements. This can reducesputtering of the dome, but at the same time gives some small capacitivecoupling to plasma, which can be used to assist ignition. In someimplementations, a second. Faraday shield can be used in combinationwith this secondary inductive element 740 to reduce capacitive couplingof the secondary inductive element 740.

In some implementations, the plasma processing apparatus 700 can includea radio frequency (RF) bias electrode 760 disposed within the processingchamber 701. The plasma processing apparatus 700 can further include aground plane 770 disposed within the processing chamber 701 such thatthe ground plane 770 is spaced apart from the RF bias electrode 760along the vertical direction V. As shown, the RF bias electrode 760 andthe ground plane 770 can, in some implementations, be disposed withinthe pedestal 704.

In some implementations, the RF bias electrode 760 can be coupled to aRF power generator 780 via a suitable matching network 782. When the RFpower generator 780 provides RF energy to the RF bias electrode 760, aplasma can be generated from a mixture in the processing chamber 701 fordirect exposure to the substrate 706. In some implementations, the RFbias electrode 760 can define a RF zone 762 that extends between a firstend 764 of the RF bias electrode 760 and a second end 766 of the RF biaselectrode 760 along the lateral direction L. For instance, in someimplementations, the RF zone 762 can span from the first end 764 of theRF bias electrode 760 to the second end 766 of the RF bias electrode 760along the lateral direction L. The RF zone 762 can further extendbetween the RF bias electrode 760 and the dielectric window 710 alongthe vertical direction V.

It should be understood that a length of the ground plane 770 along thelateral direction L is greater than a length of the RF bias electrode760 along the lateral direction L. In this manner, the ground plane 770can direct RF energy towards emitted by the RF bias electrode 760towards the substrate 706.

Referring now to FIGS. 19 and 20, a focus ring adjustment assembly 800for a focus ring 790 of the plasma processing apparatus 700 (FIG. 18) isprovided according to example embodiments of the present disclosure. Asshown, the focus ring adjustment assembly 800 can include a lift pin 810movable along the vertical direction V to move the focus ring 790between at least a first position (FIG. 19) and a second position (FIG.20) to adjust a distance between the focus ring 790 and the pedestal 704along the vertical direction V. For instance, the focus ring 790 can bespaced apart from the pedestal 704 by a first distance D1 (e.g., zero orvery close to zero such that the focus ring is supported on the pedestal704) when the focus ring 790 is in the first position (FIG. 19).Furthermore, the focus ring 790 can be spaced apart from the pedestal704 by a second distance D2 when the focus ring 790 is in the secondposition (FIG. 20). As shown, the second distance D2 can be differentthan the first distance D1. In particular, the second distance D2 can begreater than the first distance D1. In this manner, the focus ringadjustment assembly 800, specifically the pin 810 thereof, can move thefocus ring 790 from the first position (FIG. 19) to the second position(FIG. 20) to facilitate removal of the focus ring 790 from theprocessing chamber 701 using, for instance, the end effector discussedabove with reference to FIGS. 9 through 12B.

As shown, the lift pin 810 can be positioned outside of the RF zone 762defined by the RF bias electrode 760. Furthermore, the lift pin 810 canpenetrate the ground plane 770. For instance, in some implementations,the lift pin 810 can extend through an opening defined by the groundplane 770. It should be understood that locating the lift pin 810outside of the RF zone 762 and additionally having the lift pin 810penetrate the ground plane 770 can reduce arcing risks associated withapplying RF power (e.g. bias power) from the RF power generator 780 tothe RF bias electrode 760 during a plasma process. Furthermore,interference (e.g., electrical and mechanical) between the lift pin 810and the focus ring 790 can be reduced.

In some implementations, the focus ring adjustment assembly 800 caninclude an actuator 820 configured to move the lift pin 810 along thevertical direction V to facilitate movement of the focus ring 790between at least the first position (FIG. 19) and the second position(FIG. 20). As shown, the actuator 820 can be positioned outside of theprocessing chamber 701. Additionally, the focus ring adjustment assembly800 can include a second actuator 822 configured to rotate the lift pin810 about the vertical direction V. As shown, the second actuator 822can be positioned outside of the processing chamber 701.

While the present subject matter has been described in detail withrespect to specific example embodiments thereof, it will be appreciatedthat those skilled in the art, upon attaining an understanding of theforegoing can readily produce alterations to, variations of, andequivalents to such embodiments. Accordingly, the scope of the presentdisclosure is by way of example rather than by way of limitation, andthe subject disclosure does not preclude inclusion of suchmodifications, variations and/or additions to the present subject matteras would be readily apparent to one of ordinary skill in the art.

What is claimed is:
 1. A focus ring adjustment assembly of a system forprocessing workpieces under vacuum, the focus ring extending along avertical direction between an upper side and a lower side, the lowerside having a first surface portion and a. second surface portion, thefirst surface portion being vertically above the second surface portion,the focus ring adjustment assembly comprising: a pin extending between aproximal end and a distal end, the distal end being configured toselectively contact the first surface portion of the focus ring; and anactuator operable to move the pin along the vertical direction betweenan extended position and a retracted position, wherein the extendedposition of the pin is associated with the distal end of the pincontacting the first surface of the focus ring, and the focus ring beingaccessible for removal by a workpiece handling robot from a vacuumprocess chamber.
 2. The adjustment assembly of claim 1, wherein thefocus ring is positioned vertically higher along the vertical directionwhen the pin is in the extended position relative to when the pin is ina retracted position.
 3. The adjustment assembly of claim 1, wherein thefocus ring comprises a backside annular groove.
 4. The adjustmentassembly of claim 1, further comprising a rotary actuator configured toselectively rotate the pin, wherein rotation of the pin through apredefined locking angle secures the focus ring to the pin.
 5. Theadjustment assembly of claim 1, wherein the pin has a main body portionand a flange portion, the main body portion extending between theproximal end and the distal end, the flange portion being spaced apartfrom the distal end of the pin and extending outwardly from the mainbody portion, wherein the flange portion is configured to contact atransition surface portion positioned vertically between the firstsurface portion and the second surface portion of the focus ring whenthe distal end of the pin is contacts the first surface portion of thefocus ring.
 6. The adjustment assembly of claim 1 further comprising: asupport plate positioned within the vacuum process chamber; a floatingcoupling fixed to the proximal end of the pin, the floating couplingbeing slidably supported by the support plate such that the floatingcoupling is movable relative the support plate in a horizontaldirection, wherein the actuator is configured to move the support platealong the vertical direction between a raised position and a loweredposition to move the pin between the extended position and the retractedposition, the raised position of the support plate being associated withthe extended position of the pin and the lowered position of the supportplate being associated with the retracted position of the pin.
 7. Theadjustment assembly of claim 6, wherein the actuator is vacuum sealed,the actuator being positioned exterior to the vacuum process chamber,the actuator being coupled to the support plate via a connection shaftextending through an exterior wall of the vacuum process chamber.
 8. Afocus ring adjustment assembly of a system for processing workpiecesunder vacuum, a focus ring extending between an upper side and a lowerside along a vertical direction, the focus ring having a groove recessedinwardly from the lower side towards the upper side, the focus ringadjustment assembly comprising: a pin extending between a proximal endand a distal end, the distal end being configured to selectively contactthe groove; and an actuator operable to move the pin along the verticaldirection between an extended position and a retracted position, whereinthe extended position of the pin is associated with the distal end ofthe pin contacting the groove, and the focus ring being accessible forremoval from the vacuum process chamber by a workpiece handling robot.9. The adjustment assembly of claim 8, wherein the focus ring extendsbetween an inner surface and an outer surface along a radial direction,the groove being spaced apart from the inner and outer surfaces.
 10. Theadjustment assembly of claim 8, wherein the groove has a first grooveportion and a second groove portion, the first groove portion extendingfrom the lower side of the focus ring to a. first distance from thelower side, the second groove portion extending from the first distanceto a second distance from the lower side, the second distance being lessthan a thickness of the focus ring between the upper and lower sidesalong the vertical direction.
 11. The adjustment assembly of claim 10,wherein the pin has a main body portion and a flange portion, the mainbody portion extending between the proximal and distal ends, the flangeportion being spaced apart from the distal end of the pin and extendingoutwardly from the main body portion, wherein the flange portion isconfigured to be at least partially received within the first grooveportion, and the portion of the pin extending between the flange portionand the distal end being at least partially received within the secondgroove portion.
 12. The adjustment assembly of claim 8, wherein thefocus ring is positioned vertically higher along the vertical directionwhen the pin is in the extended position relative to when the pin is inthe retracted position.
 13. The adjustment assembly of claim 8, whereinthe focus ring comprises a backside annular groove.
 14. The adjustmentassembly of claim 8, further comprising: a support plate positionedwithin the vacuum process chamber and adjacent to an exterior wall ofthe vacuum process chamber; a floating coupling fixed to the proximalend of the pin, the floating coupling being slidably supported by thesupport plate such that the floating coupling is movable relative thesupport plate in a horizontal direction, wherein the actuator isconfigured to move the support plate along the vertical directionbetween a raised position and a lowered position to move the pin betweenthe extended position and the retracted position, the raised position ofthe support plate being associated with the extended position of the pinand the lowered position of the support plate being associated with theretracted position of the pin.
 15. The adjustment assembly of claim 14,wherein the actuator is vacuum sealed, the actuator being positionedexterior to the vacuum process chamber, the actuator being coupled tothe support plate via a connection shaft extending through the exteriorwall of the vacuum process chamber.